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Patent applications and USPTO patent grants for Makino; Nobuya.The latest application filed is for "packaging method".
Patent | Date |
---|---|
Packaging method Grant 7,470,996 - Yoneyama , et al. December 30, 2 | 2008-12-30 |
Substrate package structure and packaging method thereof Grant 7,405,478 - Ishikawa , et al. July 29, 2 | 2008-07-29 |
Wire bonding method and semiconductor device Grant 7,285,854 - Ishikawa , et al. October 23, 2 | 2007-10-23 |
Packaging method App 20070023483 - Yoneyama; Takao ;   et al. | 2007-02-01 |
Substrate package structure and packaging method thereof App 20060113668 - Ishikawa; Katsumi ;   et al. | 2006-06-01 |
Wire bonding method and semiconductor device App 20050205995 - Ishikawa, Katsumi ;   et al. | 2005-09-22 |
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