Makimoto, Hirofumi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Makimoto, Hirofumi.The latest application filed is for "chip scale packaged semiconductor device".
- Makimoto, Hirofumi - Kumamoto JP
| Patent | Date |
|---|---|
| Chip scale packaged semiconductor device App 20050093180 - Makimoto, Hirofumi | 2005-05-05 |
| Method of making chip scale package Grant 6,830,958 - Makimoto December 14, 2 | 2004-12-14 |
| Semiconductor device and method of manufacturing the same App 20030173656 - Makimoto, Hirofumi | 2003-09-18 |
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