loadpatents
Patent applications and USPTO patent grants for Maki; Yayoi.The latest application filed is for "method of mounting terminal and terminal mounting structure".
Patent | Date |
---|---|
Method of mounting terminal and terminal mounting structure Grant 7,189,081 - Tanaka , et al. March 13, 2 | 2007-03-13 |
Terminal holding and heat dissipating structure Grant 6,942,499 - Tanaka , et al. September 13, 2 | 2005-09-13 |
Substrate-stacking structure Grant 6,671,173 - Ashiya , et al. December 30, 2 | 2003-12-30 |
Holding and heat dissipation structure for heat generation part Grant 6,643,134 - Ashiya , et al. November 4, 2 | 2003-11-04 |
Method of mounting terminal and terminal mounting structure App 20030134528 - Tanaka, Yoshiyuki ;   et al. | 2003-07-17 |
Holding and heat dissipation structure for heat generation part App 20020163783 - Ashiya, Hiroyuki ;   et al. | 2002-11-07 |
Substrate-stacking structure App 20020131239 - Ashiya, Hiroyuki ;   et al. | 2002-09-19 |
Terminal holding and heat dissipating structure App 20020124994 - Tanaka, Yoshiyuki ;   et al. | 2002-09-12 |
Electrical component connecting structure of wiring board Grant 6,372,998 - Suzuki , et al. April 16, 2 | 2002-04-16 |
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