loadpatents
name:-0.010982990264893
name:-0.021543979644775
name:-0.00057005882263184
Maki; Toshihiro Patent Filings

Maki; Toshihiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Maki; Toshihiro.The latest application filed is for "method and structure for connecting a terminal with a wire".

Company Profile
0.21.9
  • Maki; Toshihiro - Yokohama JP
  • Maki; Toshihiro - Shizuoka JP
  • Maki; Toshihiro - Haibara-gun JP
  • Maki, Toshihiro - US
  • Maki, Toshihiro - Yokohama-Shi JP
  • Maki; Toshihiro - Shizuoka-ken JP
  • Maki; Toshihiro - Kanagawa JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Interconnector line of thin film, sputter target for forming the wiring film and electronic component using the same
Grant RE45,481 - Ishigami , et al. April 21, 2
2015-04-21
Interconnector line of thin film, sputter target for forming the wiring film and electronic component using the same
Grant RE41,975 - Ishigami , et al. November 30, 2
2010-11-30
Mo-W material for formation of wiring, Mo-W target and method for production thereof, and Mo-W wiring thin film
Grant 7,153,589 - Kohsaka , et al. December 26, 2
2006-12-26
Method and structure for connecting a terminal with a wire
Grant 6,976,889 - Kuwayama , et al. December 20, 2
2005-12-20
Method and structure for connecting a terminal with a wire
Grant 6,893,301 - Kuwayama , et al. May 17, 2
2005-05-17
Method and structure for connecting a terminal with a wire
App 20050037677 - Kuwayama, Yasumichi ;   et al.
2005-02-17
Structure for waterproofing terminal-wire connecting portion and method of waterproofing the same
App 20040157505 - Kuwayama, Yasumichi ;   et al.
2004-08-12
Structure for waterproofing terminal-wire connecting portion and method of waterproofing the same
Grant 6,770,817 - Kuwayama , et al. August 3, 2
2004-08-03
Crimp terminal
Grant 6,749,457 - Sakaguchi , et al. June 15, 2
2004-06-15
Method and structure for connecting a terminal with a wire
Grant 6,739,899 - Kuwayama , et al. May 25, 2
2004-05-25
Wire connecting structure and connecting method
Grant 6,734,359 - Hanazaki , et al. May 11, 2
2004-05-11
Method and structure for connecting a terminal with a wire
App 20040040150 - Kuwayama, Yasumichi ;   et al.
2004-03-04
Press-clamping terminal and method of examining press-clamped condition thereof
Grant 6,626,711 - Kitagawa , et al. September 30, 2
2003-09-30
Method of determining a connection state of metal terminal and a wire
Grant 6,625,884 - Fukase , et al. September 30, 2
2003-09-30
Method and structure for connecting a terminal with a wire
App 20030022562 - Kuwayama, Yasumichi ;   et al.
2003-01-30
Crimp terminal
App 20030013353 - Sakaguchi, Tadahisa ;   et al.
2003-01-16
Wire connecting structure and connecting method
App 20020096353 - Hanazaki, Hisashi ;   et al.
2002-07-25
Structure for waterproofing terminal-wire connecting portion and method of waterproofing the same
App 20020096352 - Kuwayama, Yasumichi ;   et al.
2002-07-25
Press-clamping terminal and method of examining press-clamped condition thereof
App 20020022414 - Kitagawa, Hironori ;   et al.
2002-02-21
Interconnector line of thin film, sputter target for forming the wiring film and electronic component using the same
Grant 6,329,275 - Ishigami , et al. December 11, 2
2001-12-11
Refractory metal silicide target, method of manufacturing the target, refractory metal silicide thin film, and semiconductor device
App 20010037938 - Sato, Michio ;   et al.
2001-11-08
Metal terminal and wire connector
Grant 6,113,441 - Fukase , et al. September 5, 2
2000-09-05
Mo-W material for formation of wiring, Mo-W target and method for production thereof, and Mo-W wiring thin film
Grant 5,913,100 - Kohsaka , et al. June 15, 1
1999-06-15
Electrical terminal
Grant 5,634,825 - Maki June 3, 1
1997-06-03
Ti-W sputtering target and method for manufacturing same
Grant 5,470,527 - Yamanobe , et al. November 28, 1
1995-11-28
Sputtering target and method of manufacturing the same
Grant 5,418,071 - Satou , et al. * May 23, 1
1995-05-23
Highly purified metal material and sputtering target using the same
Grant 5,196,916 - Ishigami , et al. March 23, 1
1993-03-23
Housing for an electrical connector
Grant D316,703 - Eto , et al. May 7, 1
1991-05-07
Housing for an electrical connector
Grant D316,704 - Eto , et al. May 7, 1
1991-05-07

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