Maki; Hiroshi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Maki; Hiroshi.The latest application filed is for "seat back".
Company Profile
4.57.47
- Maki; Hiroshi - Aichi-ken JP
- MAKI; Hiroshi - Minami-Alps JP
- Maki; Hiroshi - Sakura JP
- Maki; Hiroshi - Kumagaya N/A JP
- Maki; Hiroshi - Sakura-shi JP
- Maki; Hiroshi - Tokyo JP
- Maki; Hiroshi - Ryuou N/A JP
- Maki; Hiroshi - Kai JP
- Maki; Hiroshi - Kanagawa-ken JP
- Maki; Hiroshi - Kanagawa JP
- Maki; Hiroshi - Kawasaki JP
- Maki; Hiroshi - Zama JP
- Maki; Hiroshi - Ichihara JP
- Maki; Hiroshi - Takatsuki JA
Patent Activity
| Patent | Date |
|---|---|
| Seat back Grant 11,059,401 - Nakamura , et al. July 13, 2 | 2021-07-13 |
| Seat back Grant 11,040,645 - Nakamura , et al. June 22, 2 | 2021-06-22 |
| Seat Back App 20200339021 - NAKAMURA; Genzo ; et al. | 2020-10-29 |
| Seat Back App 20200339020 - NAKAMURA; Genzo ; et al. | 2020-10-29 |
| Semiconductor Manufacturing Apparatus and Manufacturing Method for Semiconductor Device App 20200312699 - YOKOMORI; Tsuyoshi ; et al. | 2020-10-01 |
| Organic thin film, and organic semiconductor device and organic transistor using same Grant 10,158,087 - Hanna , et al. Dec | 2018-12-18 |
| Die bonder and bonding method Grant 10,096,526 - Mochizuki , et al. October 9, 2 | 2018-10-09 |
| Liquid Crystal Display Device Grant 9,951,275 - Ogawa , et al. April 24, 2 | 2018-04-24 |
| Liquid crystal display device Grant 9,810,938 - Kuriyama , et al. November 7, 2 | 2017-11-07 |
| Liquid crystal display device Grant 9,464,231 - Ogawa , et al. October 11, 2 | 2016-10-11 |
| Liquid crystal display device Grant 9,436,032 - Kuriyama , et al. September 6, 2 | 2016-09-06 |
| Liquid Crystal Display Device App 20160252772 - Kuriyama; Takeshi ; et al. | 2016-09-01 |
| Collet cleaning method and die bonder using the same Grant 9,318,361 - Ishii , et al. April 19, 2 | 2016-04-19 |
| Liquid Crystal Display Device App 20160054619 - Kuriyama; Takeshi ; et al. | 2016-02-25 |
| Organic Thin Film, And Organic Semiconductor Device And Organic Transistor Using Same App 20160049596 - HANNA; Junichi ; et al. | 2016-02-18 |
| Liquid Crystal Display Device App 20160009997 - Ogawa; Shinji ; et al. | 2016-01-14 |
| Liquid Crystal Display Device App 20150315471 - Ogawa; Shinji ; et al. | 2015-11-05 |
| Die bonder and bonding method Grant 8,991,681 - Maki , et al. March 31, 2 | 2015-03-31 |
| Collet Cleaning Method and Die Bonder Using the Same App 20140251535 - ISHII; Yoshihide ; et al. | 2014-09-11 |
| Foreign substance removing device and die bonder equipped with the same Grant 8,783,319 - Yamagami , et al. July 22, 2 | 2014-07-22 |
| Die bonder and bonding method Grant 8,727,202 - Nakajima , et al. May 20, 2 | 2014-05-20 |
| Fabrication method of semiconductor device Grant 8,703,583 - Maki , et al. April 22, 2 | 2014-04-22 |
| Fabrication method of semiconductor integrated circuit device Grant 8,640,943 - Maki , et al. February 4, 2 | 2014-02-04 |
| Manufacturing Method Of Semiconductor Integrated Circuit Device App 20130330879 - MAKI; Hiroshi ; et al. | 2013-12-12 |
| Tool management method of die bonder and die bonder Grant 8,593,261 - Takagi , et al. November 26, 2 | 2013-11-26 |
| Manufacturing Method For Semiconductor Integrated Device App 20130299098 - MAKI; Hiroshi ; et al. | 2013-11-14 |
| Fabrication method of semiconductor device Grant 8,574,933 - Kobashi , et al. November 5, 2 | 2013-11-05 |
| Die bonder, pickup method, and pickup device Grant 8,561,664 - Maki , et al. October 22, 2 | 2013-10-22 |
| Manufacturing method for semiconductor integrated device Grant 8,492,173 - Maki , et al. July 23, 2 | 2013-07-23 |
| Manufacturing method of semiconductor integrated circuit device Grant 8,450,150 - Maki , et al. May 28, 2 | 2013-05-28 |
| Manufacturing Method For Semiconductor Integrated Device App 20130130408 - MAKI; Hiroshi ; et al. | 2013-05-23 |
| Fabrication Method Of Semiconductor Device App 20130122615 - KOBASHI; Hideharu ; et al. | 2013-05-16 |
| Die Bonder and Bonding Method App 20130068826 - Maki; Hiroshi ; et al. | 2013-03-21 |
| Die Bonder and Bonding Method App 20130068823 - MAKI; Hiroshi ; et al. | 2013-03-21 |
| Die Bonder and Bonding Method App 20130071956 - NAKAJIMA; Nobuhisa ; et al. | 2013-03-21 |
| Die Bonder and Bonding Method App 20130068824 - MOCHIZUKI; Masayuki ; et al. | 2013-03-21 |
| Manufacturing method for semiconductor integrated device Grant 8,372,665 - Maki , et al. February 12, 2 | 2013-02-12 |
| Fabrication method of semiconductor device Grant 8,367,433 - Kobashi , et al. February 5, 2 | 2013-02-05 |
| Fabrication Method Of Semiconductor Integrated Circuit Device App 20120329211 - MAKI; Hiroshi ; et al. | 2012-12-27 |
| Manufacturing Method For Semiconductor Integrated Device App 20120270340 - MAKI; HIROSHI ; et al. | 2012-10-25 |
| Fabrication method of semiconductor integrated circuit device Grant 8,292,159 - Maki , et al. October 23, 2 | 2012-10-23 |
| Foreign Substance Removing Device and Die Bonder Equipped with the Same App 20120241096 - YAMAGAMI; Takashi ; et al. | 2012-09-27 |
| Manufacturing method for semiconductor integrated device Grant 8,222,050 - Maki , et al. July 17, 2 | 2012-07-17 |
| Semiconductor manufacturing method of die pick-up from wafer Grant 8,211,261 - Maki , et al. July 3, 2 | 2012-07-03 |
| Tool Management Method of Die Bonder and Die Bonder App 20120075079 - TAKAGI; Susumu ; et al. | 2012-03-29 |
| Fabrication Method Of Semiconductor Integrated Circuit Device App 20120058603 - MAKI; Hiroshi ; et al. | 2012-03-08 |
| Die Bonder, Pickup Method, And Pickup Device App 20110308738 - Maki; Hiroshi ; et al. | 2011-12-22 |
| Fabrication method of semiconductor integrated circuit device Grant 8,074,868 - Maki , et al. December 13, 2 | 2011-12-13 |
| Manufacturing Method For Semiconductor Integrated Device App 20110290427 - Maki; Hiroshi ; et al. | 2011-12-01 |
| Manufacturing method for semiconductor integrated device Grant 8,003,495 - Maki , et al. August 23, 2 | 2011-08-23 |
| Manufacturing Method For Semiconductor Integrated Device App 20110097849 - Maki; Hiroshi ; et al. | 2011-04-28 |
| Fabrication Method Of Semiconductor Integrated Circuit Device App 20110070696 - Maki; Hiroshi ; et al. | 2011-03-24 |
| Manufacturing method for semiconductor integrated device Grant 7,888,141 - Maki , et al. February 15, 2 | 2011-02-15 |
| Fabrication method of semiconductor integrated circuit device Grant 7,861,912 - Maki , et al. January 4, 2 | 2011-01-04 |
| Fabrication Method Of Semiconductor Device App 20100285615 - KOBASHI; HIDEHARU ; et al. | 2010-11-11 |
| Fabrication Method Of Semiconductor Integrated Circuit Device App 20100279464 - MAKI; Hiroshi ; et al. | 2010-11-04 |
| Semiconductor Manufacturing Method Of Die Pick-up From Wafer App 20100279465 - MAKI; Hiroshi ; et al. | 2010-11-04 |
| Fabrication method of semiconductor device Grant 7,824,932 - Kobashi , et al. November 2, 2 | 2010-11-02 |
| Manufacturing Method Of Semiconductor Integrated Circuit Device App 20100261312 - MAKI; Hiroshi ; et al. | 2010-10-14 |
| Fabrication method of semiconductor integrated circuit device Grant 7,757,930 - Maki , et al. July 20, 2 | 2010-07-20 |
| Semiconductor manufacturing method of die pick-up from wafer Grant 7,759,164 - Maki , et al. July 20, 2 | 2010-07-20 |
| Fabrication Method of Semiconductor Device App 20100055878 - MAKI; Hiroshi ; et al. | 2010-03-04 |
| Fabrication method of semiconductor device Grant 7,629,231 - Maki , et al. December 8, 2 | 2009-12-08 |
| Fabrication Method Of Semiconductor Device App 20090215204 - KOBASHI; Hideharu ; et al. | 2009-08-27 |
| Semiconductor Manufacturing Method Of Die Pick-up From Wafer App 20090170290 - MAKI; Hiroshi ; et al. | 2009-07-02 |
| Semiconductor manufacturing method of die pick-up from wafer Grant 7,498,241 - Maki , et al. March 3, 2 | 2009-03-03 |
| Manufacturing Method For Semiconductor Integrated Device App 20080318346 - Maki; Hiroshi ; et al. | 2008-12-25 |
| Fabrication Method Of Semiconductor Device App 20080057599 - Kobashi; Hideharu ; et al. | 2008-03-06 |
| Fabrication method of semiconductor integrated circuit device App 20070287262 - MAKI; Hiroshi ; et al. | 2007-12-13 |
| Fabrication Method Of Semiconductor Device App 20070275544 - Maki; Hiroshi ; et al. | 2007-11-29 |
| Method of fabrication of semiconductor integrated circuit device Grant 7,270,258 - Maki , et al. September 18, 2 | 2007-09-18 |
| Method of manufacturing semiconductor device Grant 7,115,482 - Maki , et al. October 3, 2 | 2006-10-03 |
| Semiconductor manufacturing method of die-pick-up from wafer App 20060166466 - Maki; Hiroshi ; et al. | 2006-07-27 |
| Method of manufacturing a semiconductor device Grant 7,015,071 - Wada , et al. March 21, 2 | 2006-03-21 |
| Fabrication method of semiconductor integrated circuit device App 20050061856 - Maki, Hiroshi ; et al. | 2005-03-24 |
| Method of manufacturing semiconductor device App 20050059205 - Maki, Hiroshi ; et al. | 2005-03-17 |
| Projection display apparatus Grant 6,844,979 - Maki , et al. January 18, 2 | 2005-01-18 |
| Method of manufacturing a semiconductor device App 20050009299 - Wada, Takashi ; et al. | 2005-01-13 |
| Projection display apparatus App 20030231287 - Maki, Hiroshi ; et al. | 2003-12-18 |
| Projection type display apparatus Grant 6,609,796 - Maki , et al. August 26, 2 | 2003-08-26 |
| Projection type display apparatus App 20020063853 - Maki, Hiroshi ; et al. | 2002-05-30 |
| Projection type display apparatus Grant 6,345,895 - Maki , et al. February 12, 2 | 2002-02-12 |
| Outfit supporting member and outfit made by using the same Grant 6,291,738 - Uchino , et al. September 18, 2 | 2001-09-18 |
| Portable wireless receiver Grant 5,884,199 - Maki March 16, 1 | 1999-03-16 |
| Method and apparatus for magnetically detecting defects in an object with compensation for magnetic field shift by means of a compensating coil Grant 5,512,821 - Ando , et al. April 30, 1 | 1996-04-30 |
| Method for preventing the discoloration of dihydric phenols Grant 4,308,406 - Takenaka , et al. December 29, 1 | 1981-12-29 |
| Rubber-modified polystyrene resin composition Grant 4,075,285 - Tabana , et al. February 21, 1 | 1978-02-21 |
| Thermoplastic resin composition Grant 4,073,831 - Tabana , et al. February 14, 1 | 1978-02-14 |
| Thermoplastic resin composition Grant 4,017,436 - Tabana , et al. April 12, 1 | 1977-04-12 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 