Makabe; Hiroaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Makabe; Hiroaki.The latest application filed is for "preparation of norbornane-based pac ballasts".

Company Profile

0.14.11

Makabe; Hiroaki - Tokyo JP
Makabe; Hiroaki - Shinagawa-ku JP
Makabe; Hiroaki - Utsunomiya JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Preparation of norbornane-based PAC ballasts Grant 9,261,781 - Bell , et al. February 16, 2	2016-02-16
Preparation of Norbornane-based PAC Ballasts App 20130323640 - Bell; Andrew ; et al.	2013-12-05
Preparation of norbornane-based PAC ballasts Grant 8,530,133 - Bell , et al. September 10, 2	2013-09-10
Positive photosensitive resin composition, cured film, protective film, interlayer insulating film, and semiconductor device and display element using the same Grant 8,530,119 - Hirano , et al. September 10, 2	2013-09-10
Positive photosensitive resin composition, cured film, protecting film, insulating film, and semiconductor device and display device using the same Grant 8,440,734 - Sugiyama , et al. May 14, 2	2013-05-14
Preparation of Norbornane-based PAC Ballasts App 20120135352 - Bell; Andrew ; et al.	2012-05-31
Positive Photosensitive Resin Composition, Cured Film, Protective Film, Interlayer Insulating Film, And Semiconductor Device And Display Element Using The Same App 20120100484 - Hirano; Takashi ; et al.	2012-04-26
Positive Photosensitive Resin Composition, Cured Film, Protecting Film, Insulating Film, And Semiconductor Device And Display Device Using The Same App 20110118375 - Sugiyama; Hiromichi ; et al.	2011-05-19
Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films Grant 7,858,721 - Amoroso , et al. December 28, 2	2010-12-28
Positive photosensitive resin composition, cured layer , protecting layer, insulating layer and semiconductor device and display therewith Grant 7,781,131 - Makabe August 24, 2	2010-08-24
Positive photosensitive resin composition, cured film, protective film, insulating film, and semiconductor device and display device therewith App 20100196808 - Mizushima; Ayako ; et al.	2010-08-05
Photosensitive Resin Composition, Cured Film, Protective Film, Insulating Film, Semiconductor Device And Display Device Using The Same App 20100062273 - Makabe; Hiroaki ; et al.	2010-03-11
Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films App 20090215976 - Amoroso; Dino ; et al.	2009-08-27
Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films Grant 7,524,594 - Amoroso , et al. April 28, 2	2009-04-28
Positive Photosensitive Resin Composition, Cured Layer, Protecting Layer, Insulating Layer And Semiconductor Device And Display Therewith App 20090068584 - MAKABE; Hiroaki	2009-03-12
Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films App 20060008734 - Amoroso; Dino ; et al.	2006-01-12
Positive photosensitive resin compositions and semiconductor device Grant 6,927,013 - Banba , et al. August 9, 2	2005-08-09
Positive photosensitive resin compositions and semiconductor device App 20040146801 - Banba, Toshio ; et al.	2004-07-29
Positive photosensitive resin composition Grant 6,607,865 - Makabe , et al. August 19, 2	2003-08-19
Positive photosensitive resin composition App 20020119389 - Makabe, Hiroaki ; et al.	2002-08-29
Semiconductor device using positive photosensitive resin composition and process for preparation thereof Grant 6,235,436 - Hirano , et al. May 22, 2	2001-05-22
Positive type photosensitive resin composition and semiconductor device using the same Grant 6,071,666 - Hirano , et al. June 6, 2	2000-06-06

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