Mak; Tim Wai Tony
Patent Applications and Registrations
Patent applications and USPTO patent grants for Mak; Tim Wai Tony.The latest application filed is for "bond head for heavy wire bonder".
- Mak; Tim Wai Tony - Chai Wan HK
- Mak; Tim Wai Tony - Hong Kong CN
| Patent | Date |
|---|---|
| Handling system for inspecting and sorting electronic components Grant 8,167,524 - Cheng , et al. May 1, 2 | 2012-05-01 |
| Singulation handler system for electronic packages Grant 8,011,058 - Cheng , et al. September 6, 2 | 2011-09-06 |
| Bond head for heavy wire bonder Grant 7,762,449 - Cheng , et al. July 27, 2 | 2010-07-27 |
| Apparatus and method for arranging devices for processing Grant 7,726,540 - Cheng , et al. June 1, 2 | 2010-06-01 |
| Bond Head For Heavy Wire Bonder App 20100127045 - CHENG; Chi Wah ; et al. | 2010-05-27 |
| Handling System For Inspecting And Sorting Electronic Components App 20090129899 - CHENG; Chi Wah ; et al. | 2009-05-21 |
| Singulation Handler System For Electronic Packages App 20080101894 - Cheng; Chi Wah ; et al. | 2008-05-01 |
| Apparatus and method for aligning devices on carriers Grant 7,258,703 - Cheng , et al. August 21, 2 | 2007-08-21 |
| Apparatus and method for arranging devices for processing App 20070131733 - Cheng; Chi Wah ; et al. | 2007-06-14 |
| Apparatus and method for aligning devices on carriers App 20060154386 - Cheng; Chi Wah ; et al. | 2006-07-13 |
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