Majumdar; Diptarka

Patent Applications and Registrations

Patent applications and USPTO patent grants for Majumdar; Diptarka.The latest application filed is for "high-aspect ratio screen printable thick film paste compositions containing wax thixotropes".

Company Profile

0.5.10

Majumdar; Diptarka - Naperville IL US
Majumdar; Diptarka - Cary NC
Majumdar; Diptarka - US
Majumdar; Diptarka - Albuquerque NM

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
High-aspect Ratio Screen Printable Thick Film Paste Compositions Containing Wax Thixotropes App 20140124713 - Majumdar; Diptarka ; et al.	2014-05-08
Silver Thick Film Paste Compositions And Their Use In Conductors For Photovoltaic Cells App 20110048527 - Irizarry; Roberto ; et al.	2011-03-03
Electrodes, inner layers, capacitors, electronic devices and methods of making thereof Grant 7,741,189 - Borland , et al. June 22, 2	2010-06-22
Methods for forming process test capacitors for testing embedded passives during embedment into a printed wiring board Grant 7,649,361 - Borland , et al. January 19, 2	2010-01-19
Innerlayer panels and printed wiring boards with embedded fiducials Grant 7,586,198 - Borland , et al. September 8, 2	2009-09-08
Methods for Forming Process Test Capacitors for Testing Embedded Passives During Embedment into a Printed Wiring Board App 20080145995 - Borland; William J. ; et al.	2008-06-19
Hydrophobic crosslinkable compositions for electronic applications App 20070244267 - Dueber; Thomas E. ; et al.	2007-10-18
Organic encapsulant compositions for protection of electronic components App 20070236859 - Borland; William J. ; et al.	2007-10-11
Method of making interlayer panels Grant 7,178,229 - Borland , et al. February 20, 2	2007-02-20
Electrodes, inner layers, capacitors and printed wiring boards and methods of making thereof - part II App 20060282999 - Majumdar; Diptarka ; et al.	2006-12-21
Electrodes, inner layers, capacitors, electronic devices and methods of making thereof App 20060284280 - Borland; William J. ; et al.	2006-12-21
Method of making innerlayer panels and printed wiring boards using X-ray identification of fiducials App 20060101639 - Borland; William J. ; et al.	2006-05-18
Method of making innerlayer panels and printed wiring boards using X-ray identification of fiducials App 20050111206 - Borland, William J. ; et al.	2005-05-26
Method for making copper I oxide powders by aerosol decomposition Grant 5,861,136 - Glicksman , et al. January 19, 1	1999-01-19

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