maity nirmalya

Patent Applications and Registrations

Patent applications and USPTO patent grants for maity nirmalya.The latest application filed is for "integration of ald tantalum nitride for copper metallization".

Company Profile

2.14.19

- Acton MA US
Maity; Nirmalya - Acton MA
Maity; Nirmalya - Los Altos CA
Maity, Nirmalya - San Jose CA
Maity, Nirmalya - Sunnyvale CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Insulated pipe and method for preparing the same Grant 08616246 -	2013-12-31
Insulated pipe and method for preparing the same Grant 8,616,246 - Dinon , et al. December 31, 2	2013-12-31
Integration of ALD tantalum nitride for copper metallization Grant 8,324,095 - Chung , et al. December 4, 2	2012-12-04
Small scanned magentron Grant 7,807,030 - Hong , et al. October 5, 2	2010-10-05
Atomic layer deposition of tantalum-containing materials using the tantalum precursor TAIMATA Grant 7,691,742 - Marcadal , et al. April 6, 2	2010-04-06
Integration Of Ald Tantalum Nitride For Copper Metallization App 20100075494 - Chung; Hua ; et al.	2010-03-25
Atomic layer deposition of barrier materials Grant 7,595,263 - Chung , et al. September 29, 2	2009-09-29
Insulated Pipe And Method For Preparing The Same App 20090205737 - Dinon; John L. ; et al.	2009-08-20
Atomic Layer Deposition Of Tantalum-containing Materials Using The Tantalum Precursor Taimata App 20090202710 - Marcadal; Christophe ; et al.	2009-08-13
Atomic layer deposition of tantalum-containing materials using the tantalum precursor TAIMATA Grant 7,524,762 - Marcadal , et al. April 28, 2	2009-04-28
Atomic Layer Deposition Of Tantalum-containing Materials Using The Tantalum Precursor Taimata App 20080032041 - Marcadal; Christophe ; et al.	2008-02-07
Ruthenium layer formation for copper film deposition Grant 7,264,846 - Chang , et al. September 4, 2	2007-09-04
Atomic Layer Deposition Of Barrier Materials App 20070190780 - CHUNG; HUA ; et al.	2007-08-16
Atomic layer deposition of tantalum-containing materials using the tantalum precursor TAIMATA Grant 7,241,686 - Marcadal , et al. July 10, 2	2007-07-10
Small Scanned Magentron App 20070102284 - HONG; Ilyoung Richard ; et al.	2007-05-10
Atomic layer deposition of tantalum based barrier materials Grant 7,211,508 - Chung , et al. May 1, 2	2007-05-01
Magnetron executing planetary motion adjacent a sputtering target Grant 7,169,271 - Hong , et al. January 30, 2	2007-01-30
Insulated pipe and method for preparing same App 20060272727 - Dinon; John L. ; et al.	2006-12-07
Ruthenium layer formation for copper film deposition App 20060153973 - Chang; Mei ; et al.	2006-07-13
Integration of ALD tantalum nitride for copper metallization App 20060148253 - Chung; Hua ; et al.	2006-07-06
Integration of ALD tantalum nitride for copper metallization Grant 7,049,226 - Chung , et al. May 23, 2	2006-05-23
Atomic layer deposition of tantalum-containing materials using the tantalum precursor taimata App 20060019495 - Marcadal; Christophe ; et al.	2006-01-26
Integration of ALD tantalum nitride for copper metallization App 20050106865 - Chung, Hua ; et al.	2005-05-19
Atomic layer deposition of barrier materials App 20050009325 - Chung, Hua ; et al.	2005-01-13
Small planetary magnetron Grant 6,841,050 - Hong , et al. January 11, 2	2005-01-11
Magnetron executing planetary motion adjacent a sputtering target App 20040222087 - Hong, Ilyoung Richard ; et al.	2004-11-11
Ruthenium layer formation for copper film deposition App 20040105934 - Chang, Mei ; et al.	2004-06-03
Small planetary magnetron App 20030217913 - Hong, Ilyoung Richard ; et al.	2003-11-27
Method and apparatus for sputter deposition App 20030216035 - Rengarajan, Suraj ; et al.	2003-11-20
Self-ionized and inductively-coupled plasma for sputtering and resputtering App 20030116427 - Ding, Peijun ; et al.	2003-06-26
Alternate steps of IMP and sputtering process to improve sidewall coverage App 20020084181 - Gopalraja, Praburam ; et al.	2002-07-04
Alternate steps of IMP and sputtering process to improve sidewall coverage Grant 6,350,353 - Gopalraja , et al. February 26, 2	2002-02-26
Alternate Steps Of Imp And Sputtering Process To Improve Sidewall Coverage App 20010003607 - GOPALRAJA, PRABURAM ; et al.	2001-06-14

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