Mainardi; Richard
Patent Applications and Registrations
Patent applications and USPTO patent grants for Mainardi; Richard.The latest application filed is for "storage tray for protecting optical fibers mechanically coupled to an optoelectronic device".
- Mainardi; Richard - Hudson CA
- MAINARDI; Richard - Montreal CA
| Patent | Date |
|---|---|
| Storage tray for protecting optical fibers mechanically coupled to an optoelectronic device Grant 11,204,476 - Mainardi , et al. December 21, 2 | 2021-12-21 |
| Electro-optical assembly Grant 11,199,657 - Wohlfeil , et al. December 14, 2 | 2021-12-14 |
| Storage Tray For Protecting Optical Fibers Mechanically Coupled To An Optoelectronic Device App 20210088741 - MAINARDI; Richard ; et al. | 2021-03-25 |
| Electro-optical Assembly App 20200200971 - WOHLFEIL; Benjamin ; et al. | 2020-06-25 |
| Optical Sub-assembly With Strain Relief Feature App 20120141073 - Mainardi; Richard ; et al. | 2012-06-07 |
| Optically Enabled Integrated Circuit Package App 20100215317 - ROLSTON; David Robert Cameron ; et al. | 2010-08-26 |
| Method And Device To Improve Signal-to-noise Ratio In High-speed Optical Data Communications App 20100172609 - Rolston; David R. ; et al. | 2010-07-08 |
| Optically-enabled integrated circuit package Grant 7,729,581 - Rolston , et al. June 1, 2 | 2010-06-01 |
| Method for assembling a two substrate parallel optical sub-assembly Grant 7,537,394 - Rolston , et al. May 26, 2 | 2009-05-26 |
| Two substrate parallel optical sub-assembly Grant 7,517,159 - Rolston , et al. April 14, 2 | 2009-04-14 |
| Two Substrate Parallel Optical Sub-assembly App 20090087145 - Rolston; David R. ; et al. | 2009-04-02 |
| Method For Assembling A Two Substrate Parallel Optical Sub-assembly App 20090087146 - Rolston; David R. ; et al. | 2009-04-02 |
| Optically-enabled Integrated Circuit Package App 20070258683 - Rolston; David Robert Cameron ; et al. | 2007-11-08 |
| Optically enabled hybrid semiconductor package Grant 7,200,295 - Rolston , et al. April 3, 2 | 2007-04-03 |
| Optically enabled hybrid semiconductor package App 20060120660 - Rolston; David R. ; et al. | 2006-06-08 |
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