Maier; Lothar
Patent Applications and Registrations
Patent applications and USPTO patent grants for Maier; Lothar.The latest application filed is for "lead plating technique for singulated ic packages".
- Maier; Lothar - Pleasanton CA
- Maier; Lothar - Lachen CH
- Maier; Lothar - Eden Prairie MN
- Maier; Lothar - Tussling DE
- Maier; Lothar - Fellbach DT
| Patent | Date |
|---|---|
| Lead plating technique for singulated IC packages Grant 8,076,181 - Pruitt , et al. December 13, 2 | 2011-12-13 |
| Pen Grant D649,189 - Maier November 22, 2 | 2011-11-22 |
| Process for manufacturing a semiconductor device bump electrode using a rapid thermal anneal Grant 5,665,639 - Seppala , et al. September 9, 1 | 1997-09-09 |
| Device for interrupting the flow of current in the positive or impregnated vehicle battery cable Grant 5,621,197 - Bender , et al. April 15, 1 | 1997-04-15 |
| Injection valve Grant 3,958,757 - Happel , et al. May 25, 1 | 1976-05-25 |
| SEC | 0001253573 | MAIER LOTHAR |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 