| Patent | Date |
|---|
Semiconductor Device Including An Antenna
App 20220148951 - Huynh; Ngoc-Hoa ; et al. | 2022-05-12 |
Device and method for debonding a structure from a main surface region of a carrier
Grant 11,279,120 - Sigi , et al. March 22, 2 | 2022-03-22 |
System and method for a transducer in an EWLB package
Grant 11,211,298 - Pindl , et al. December 28, 2 | 2021-12-28 |
Semiconductor device including an antenna
Grant 11,195,787 - Huynh , et al. December 7, 2 | 2021-12-07 |
Semiconductor module
Grant 11,040,872 - Waechter , et al. June 22, 2 | 2021-06-22 |
Emitter Package for a Photoacoustic Sensor
App 20210172862 - Qi; Siyuan ; et al. | 2021-06-10 |
Semiconductor device including a cavity lid
Grant 10,626,012 - Muehlbauer , et al. | 2020-04-21 |
Method for handling a product substrate and a bonded substrate system
Grant 10,600,690 - Meyer-Berg , et al. | 2020-03-24 |
System And Method For A Transducer In An Ewlb Package
App 20200051824 - Pindl; Stephan ; et al. | 2020-02-13 |
Method For Producing A Semiconductor Module
App 20200039820 - Waechter; Claus ; et al. | 2020-02-06 |
Semiconductor package with a through port for sensor applications
Grant 10,549,985 - Maier , et al. Fe | 2020-02-04 |
System and method for a transducer in an eWLB package
Grant 10,546,752 - Pindl , et al. Ja | 2020-01-28 |
Device And Method For Debonding A Structure From A Main Surface Region Of A Carrier
App 20200023630 - Sigl; Alfred ; et al. | 2020-01-23 |
Mems Sensor, Mems Sensor System And Method For Producing A Mems Sensor System
App 20190352175 - Tumpold; David ; et al. | 2019-11-21 |
Method for producing a semiconductor module
Grant 10,435,292 - Waechter , et al. O | 2019-10-08 |
System and Method for a Transducer in an eWLB Package
App 20190148253 - Pindl; Stephan ; et al. | 2019-05-16 |
Apparatus For Determining A Characteristic Of A Fluid Having A Device Configured To Measure A Hydrostatic Pressure Of The Fluid
App 20190079055 - Moreira Araujo; Rui Miguel ; et al. | 2019-03-14 |
System and method for a transducer in an eWLB package
Grant 10,186,468 - Pindl , et al. Ja | 2019-01-22 |
Apparatus for determining a characteristic of a fluid having a device configured to measure a hydrodynamic pressure of the fluid
Grant 10,161,908 - Moreira Araujo , et al. Dec | 2018-12-25 |
Method for Handling a Product Substrate and a Bonded Substrate System
App 20180350683 - Meyer-Berg; Georg ; et al. | 2018-12-06 |
Method for handling a product substrate, a bonded substrate system and a temporary adhesive
Grant 10,056,295 - Meyer-Berg , et al. August 21, 2 | 2018-08-21 |
Temporary mechanical stabilization of semiconductor cavities
Grant 9,988,262 - Maier , et al. June 5, 2 | 2018-06-05 |
Semiconductor Package with a Through Port for Sensor Applications and Methods of Manufacture
App 20180148322 - Maier; Dominic ; et al. | 2018-05-31 |
Chip package and a method of producing the same
Grant 9,981,843 - Maier , et al. May 29, 2 | 2018-05-29 |
Temporary Mechanical Stabilization Of Semiconductor Cavities
App 20180086632 - Maier; Dominic ; et al. | 2018-03-29 |
Method For Producing A Semiconductor Module
App 20180022601 - Waechter; Claus ; et al. | 2018-01-25 |
Method of packaging integrated circuits
Grant 9,806,056 - Wachter , et al. October 31, 2 | 2017-10-31 |
Semiconductor Device Including A Mems Die
App 20170283247 - Meyer; Thorsten ; et al. | 2017-10-05 |
System and Method for a Transducer in an eWLB Package
App 20170284951 - Pindl; Stephan ; et al. | 2017-10-05 |
Apparatus for Determining a Characteristic of a Fluid
App 20170276646 - Moreira Araujo; Rui Miguel ; et al. | 2017-09-28 |
Semiconductor Device Including An Antenna
App 20170236776 - Huynh; Ngoc-Hoa ; et al. | 2017-08-17 |
Semiconductor device including a MEMS die and a conductive layer
Grant 9,725,303 - Maier , et al. August 8, 2 | 2017-08-08 |
Package arrangement including external block comprising semiconductor material and electrically conductive plastic material
Grant 9,711,462 - Beer , et al. July 18, 2 | 2017-07-18 |
Method of packaging integrated circuits and a molded package
Grant 9,487,392 - Wachter , et al. November 8, 2 | 2016-11-08 |
Chip Package and a Method of Producing the Same
App 20160311679 - Maier; Dominic ; et al. | 2016-10-27 |
Semiconductor Device Including A Cavity Lid
App 20160297672 - Muehlbauer; Franz-Xaver ; et al. | 2016-10-13 |
Method for Handling a Product Substrate, a Bonded Substrate System and a Temporary Adhesive
App 20160218039 - Meyer-Berg; Georg ; et al. | 2016-07-28 |
Electronic component
Grant 9,368,435 - Otremba , et al. June 14, 2 | 2016-06-14 |
Method of Packaging Integrated Circuits
App 20160163674 - Wachter; Ulrich ; et al. | 2016-06-09 |
Electronic Component
App 20160086876 - Otremba; Ralf ; et al. | 2016-03-24 |
Metal redistribution layer for molded substrates
Grant 9,275,878 - Wachter , et al. March 1, 2 | 2016-03-01 |
Method for fabricating a plurality of semiconductor devices
Grant 9,147,585 - Kilger , et al. September 29, 2 | 2015-09-29 |
Molded semiconductor package with backside die metallization
Grant 9,099,454 - Wachter , et al. August 4, 2 | 2015-08-04 |
Metal Redistribution Layer for Molded Substrates
App 20150091171 - Wachter; Ulrich ; et al. | 2015-04-02 |
Electrical measurement based circuit wiring layout modification method and system
Grant 8,990,744 - Beer , et al. March 24, 2 | 2015-03-24 |
Semiconductor Device
App 20150064846 - Kilger; Thomas ; et al. | 2015-03-05 |
Molded Semiconductor Package with Backside Die Metallization
App 20150041967 - Wachter; Ulrich ; et al. | 2015-02-12 |
Method of Packaging Integrated Circuits and a Molded Package
App 20150028435 - Wachter; Ulrich ; et al. | 2015-01-29 |
Semiconductor device
Grant 8,890,284 - Kilger , et al. November 18, 2 | 2014-11-18 |
Package Arrangement And Method Of Forming The Same
App 20140332936 - Beer; Gottfried ; et al. | 2014-11-13 |
Electrical Measurement Based Circuit Wiring Layout Modification Method and System
App 20140310671 - Beer; Gottfried ; et al. | 2014-10-16 |
Method of packaging integrated circuits and a molded substrate with non-functional placeholders embedded in a molding compound
Grant 8,828,807 - Wachter , et al. September 9, 2 | 2014-09-09 |
Semiconductor Device
App 20140239438 - Kilger; Thomas ; et al. | 2014-08-28 |
Device including an encapsulated semiconductor chip and manufacturing method thereof
Grant 8,421,226 - Meyer , et al. April 16, 2 | 2013-04-16 |
Device Including an Encapsulated Semiconductor Chip and Manufacturing Method Thereof
App 20110204513 - Meyer; Thorsten ; et al. | 2011-08-25 |
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