Mahulikar; Deepak
Patent Applications and Registrations
Patent applications and USPTO patent grants for Mahulikar; Deepak.The latest application filed is for "advanced fluid processing methods and systems".
Company Profile
1.73.30
- Mahulikar; Deepak - Madison CT
- Mahulikar; Deepak - Leander TX
- Mahulikar; Deepak - Kingstown RI
- Mahulikar; Deepak - North Kingstown RI
- Mahulikar; Deepak - N. Kingstown RI
- Mahulikar; Deepak - North Kingston RI
- Mahulikar; Deepak - N. Kingston RI
- Mahulikar; Deepak - Meriden CT
- Mahulikar; Deepak - West Haven CT
Patent Activity
| Patent | Date |
|---|---|
| Elevated temperature CMP compositions and methods for use thereof Grant 10,364,373 - Mahulikar | 2019-07-30 |
| Advanced Fluid Processing Methods And Systems App 20190105620 - Chou; Shih-Pin ; et al. | 2019-04-11 |
| Reduction in large particle counts in polishing slurries Grant 10,167,415 - McDonough , et al. J | 2019-01-01 |
| Advanced fluid processing methods and systems Grant 10,159,949 - Chou , et al. Dec | 2018-12-25 |
| Reduction In Large Particle Counts In Polishing Slurries App 20180187048 - McDonough; James ; et al. | 2018-07-05 |
| Elevated Temperature Cmp Compositions And Methods For Use Thereof App 20180100086 - Mahulikar; Deepak | 2018-04-12 |
| Reduction In Large Particle Counts In Polishing Slurries App 20180079931 - McDonough; James ; et al. | 2018-03-22 |
| Reduction in large particle counts in polishing slurries Grant 9,914,852 - McDonough , et al. March 13, 2 | 2018-03-13 |
| Advanced Fluid Processing Methods And Systems App 20170259229 - Chou; Shih-Pin ; et al. | 2017-09-14 |
| Polishing compositions and methods for polishing cobalt films Grant 9,735,030 - Wang , et al. August 15, 2 | 2017-08-15 |
| Polishing compositions and methods for polishing cobalt films Grant 9,735,031 - Wang , et al. August 15, 2 | 2017-08-15 |
| Homogeneous blending Grant 9,556,371 - Mohseni , et al. January 31, 2 | 2017-01-31 |
| Polishing Compositions And Methods For Polishing Cobalt Films App 20160189976 - Wang; Luling ; et al. | 2016-06-30 |
| Polishing Compositions And Methods For Polishing Cobalt Films App 20160068710 - Wang; Luling ; et al. | 2016-03-10 |
| Reduction In Large Particle Counts In Polishing Slurries App 20160053136 - McDonough; James ; et al. | 2016-02-25 |
| Composition for advanced node front-and-back-end of line chemical mechanical polishing Grant 9,190,286 - Hu , et al. November 17, 2 | 2015-11-17 |
| Composition For Advanced Node Front-and-back-end Of Line Chemical Mechanical Polishing App 20150132957 - Hu; Bin ; et al. | 2015-05-14 |
| Fluid processing Grant 8,974,677 - Mohseni , et al. March 10, 2 | 2015-03-10 |
| Composition for advanced node front-and back-end of line chemical mechanical polishing Grant 8,961,815 - Hu , et al. February 24, 2 | 2015-02-24 |
| Cleaning Method And System App 20140238441 - Mohseni; Saeed ; et al. | 2014-08-28 |
| Ultrapure colloidal silica for use in chemical mechanical polishing applications Grant 8,779,011 - Mahulikar , et al. July 15, 2 | 2014-07-15 |
| Highly dilutable polishing concentrates and slurries Grant 8,771,540 - Kim , et al. July 8, 2 | 2014-07-08 |
| Hydrate forms of 1,2,4-triazole, processes for manufacture thereof, and compositions thereof Grant 8,742,130 - Mahulikar , et al. June 3, 2 | 2014-06-03 |
| Hydrate Forms Of 1,2,4-triazole, Processes For Manufacture Thereof, And Compositions Thereof App 20140121382 - Mahulikar; Deepak ; et al. | 2014-05-01 |
| Highly Dilutable Polishing Concentrates And Slurries App 20130288478 - Kim; Hyungjun ; et al. | 2013-10-31 |
| Highly dilutable polishing concentrates and slurries Grant 8,404,143 - Kim , et al. March 26, 2 | 2013-03-26 |
| Homogeneous Blending App 20130067998 - Mohseni; Saeed H. ; et al. | 2013-03-21 |
| Fluid processing Grant 8,303,806 - Mohseni , et al. November 6, 2 | 2012-11-06 |
| Ultrapure colloidal silica for use in chemical mechanical polishing applications Grant 8,211,193 - Mahulikar , et al. July 3, 2 | 2012-07-03 |
| Ultrapure Colloidal Silica For Use In Chemical Mechanical Polishing Applications App 20120145950 - Mahulikar; Deepak ; et al. | 2012-06-14 |
| Highly Dilutable Polishing Concentrates And Slurries App 20120145951 - Kim; Hyungjun ; et al. | 2012-06-14 |
| Highly dilutable polishing concentrates and slurries Grant 8,192,644 - Kim , et al. June 5, 2 | 2012-06-05 |
| Cleaning Method And System App 20120055865 - Mohseni; Saeed H. ; et al. | 2012-03-08 |
| Composition For Advanced Node Front-and Back-end Of Line Chemical Mechanical Polishing App 20120003901 - Hu; Bin ; et al. | 2012-01-05 |
| Fluid Processing App 20110215053 - Mohseni; Saeed H. ; et al. | 2011-09-08 |
| Highly Dilutable Polishing Concentrates And Slurries App 20110089143 - Kim; Hyungjun ; et al. | 2011-04-21 |
| Fluid Processing App 20100320127 - MOHSENI; SAEED H. ; et al. | 2010-12-23 |
| Copper polishing slurry App 20090053896 - Hu; Bin ; et al. | 2009-02-26 |
| Ultrapure colloidal silica for use in chemical mechanical polishing applications App 20070254964 - Mahulikar; Deepak ; et al. | 2007-11-01 |
| Ultrapure colloidal silica for use in chemical mechanical polishing applications App 20070075292 - Mahulikar; Deepak ; et al. | 2007-04-05 |
| Fumed silica to colloidal silica conversion process App 20060283095 - Mahulikar; Deepak ; et al. | 2006-12-21 |
| Colloidal silica based chemical mechanical polishing slurry App 20060124593 - Moyaerts; Gert R.M. ; et al. | 2006-06-15 |
| Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafers App 20040159050 - Pasqualoni, Anthony Mark ; et al. | 2004-08-19 |
| Continuous chemical mechanical polishing process for polishing multiple conductive and non-conductive layers on semiconductor wafers Grant 6,776,696 - Mahulikar , et al. August 17, 2 | 2004-08-17 |
| Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafers Grant 6,749,488 - Pasqualoni , et al. June 15, 2 | 2004-06-15 |
| Continuous chemical mechanical polishing process for polishing multiple conductive and non-conductive layers on semiconductor wafers App 20040082275 - Mahulikar, Deepak ; et al. | 2004-04-29 |
| Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafers App 20030104770 - Pasqualoni, Anthony Mark ; et al. | 2003-06-05 |
| Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafers App 20030064671 - Pasqualoni, Anthony Mark ; et al. | 2003-04-03 |
| Chemical mechanical polishing slurry system having an activator solution Grant 6,447,563 - Mahulikar September 10, 2 | 2002-09-10 |
| Ferromagnetic bullet Grant 6,158,351 - Mravic , et al. December 12, 2 | 2000-12-12 |
| Slurry compositions and method for the chemical-mechanical polishing of copper and copper alloys Grant 6,083,840 - Mravic, deceased , et al. July 4, 2 | 2000-07-04 |
| Semiconductor package with molded plastic body Grant 5,969,414 - Parthasarathi , et al. October 19, 1 | 1999-10-19 |
| Lead-free shot Grant 5,814,759 - Mravic , et al. September 29, 1 | 1998-09-29 |
| Articles using specialized vapor deposition processes Grant 5,741,544 - Mahulikar April 21, 1 | 1998-04-21 |
| Anodized aluminum substrate having increased breakdown voltage Grant 5,688,606 - Mahulikar , et al. November 18, 1 | 1997-11-18 |
| Graphite composites for electronic packaging Grant 5,650,592 - Cheskis , et al. July 22, 1 | 1997-07-22 |
| Molded plastic semiconductor package including heat spreader Grant 5,608,267 - Mahulikar , et al. March 4, 1 | 1997-03-04 |
| Components for housing an integrated circuit device Grant 5,578,869 - Hoffman , et al. November 26, 1 | 1996-11-26 |
| Leadframe having exposed, solderable outer lead ends Grant 5,563,442 - Mahulikar , et al. October 8, 1 | 1996-10-08 |
| Electronic package with improved electrical performance Grant 5,559,306 - Mahulikar September 24, 1 | 1996-09-24 |
| Method for the assembly of an electronic package Grant 5,540,378 - Mahulikar , et al. July 30, 1 | 1996-07-30 |
| Anodized aluminum substrate having increased breakdown voltage Grant 5,534,356 - Mahulikar , et al. July 9, 1 | 1996-07-09 |
| Electronic package having improved wire bonding capability Grant 5,506,446 - Hoffman , et al. April 9, 1 | 1996-04-09 |
| Adhesively sealed metal electronic package incorporating a multi-chip module Grant 5,504,372 - Braden , et al. April 2, 1 | 1996-04-02 |
| Polymer plug for electronic packages Grant 5,477,008 - Pasqualoni , et al. December 19, 1 | 1995-12-19 |
| Lead frames with improved adhesion to a polymer Grant 5,449,951 - Parthasarathi , et al. September 12, 1 | 1995-09-12 |
| Lead-free bullett Grant 5,399,187 - Mravic , et al. March 21, 1 | 1995-03-21 |
| Metal electronic package with reduced seal width Grant 5,399,805 - Tyler , et al. March 21, 1 | 1995-03-21 |
| Molded plastic semiconductor package including an aluminum alloy heat spreader Grant 5,367,196 - Mahulikar , et al. November 22, 1 | 1994-11-22 |
| Lead frames having a chromium and zinc alloy coating Grant 5,343,073 - Parthasarathi , et al. August 30, 1 | 1994-08-30 |
| Metal electronic package with reduced seal width Grant 5,324,888 - Tyler , et al. June 28, 1 | 1994-06-28 |
| Surface modified copper alloys Grant 5,320,689 - Mahulikar , et al. June 14, 1 | 1994-06-14 |
| Electronic package with stress relief channel Grant 5,315,155 - O'Donnelly , et al. May 24, 1 | 1994-05-24 |
| Surface modified copper alloys Grant 5,213,638 - Mahulikar , et al. May 25, 1 | 1993-05-25 |
| Aluminum alloy semiconductor packages Grant 5,155,299 - Mahulikar , et al. * October 13, 1 | 1992-10-13 |
| Lead frame having polymer coated surface portions Grant 5,122,858 - Mahulikar , et al. June 16, 1 | 1992-06-16 |
| Metal pin grid array package Grant 5,103,292 - Mahulikar April 7, 1 | 1992-04-07 |
| Process for manufacturing a metal pin grid array package Grant 5,098,864 - Mahulikar March 24, 1 | 1992-03-24 |
| Surface modified copper alloys Grant 5,096,508 - Breedis , et al. March 17, 1 | 1992-03-17 |
| Process for producing black integrally colored anodized aluminum components Grant 5,066,368 - Pasqualoni , et al. November 19, 1 | 1991-11-19 |
| Metal electronic package having improved resistance to electromagnetic interference Grant 5,043,534 - Mahulikar , et al. August 27, 1 | 1991-08-27 |
| Electronic packaging of components incorporating a ceramic-glass-metal composite Grant 5,024,883 - SinghDeo , et al. June 18, 1 | 1991-06-18 |
| Aluminum alloy semiconductor packages Grant 5,023,398 - Mahulikar , et al. June 11, 1 | 1991-06-11 |
| Projectile having improved baseplug Grant 5,020,439 - Winter , et al. June 4, 1 | 1991-06-04 |
| Thermal performance package for integrated circuit chip Grant 5,015,803 - Mahulikar , et al. * May 14, 1 | 1991-05-14 |
| Semiconductor die attach system Grant 4,978,052 - Fister , et al. December 18, 1 | 1990-12-18 |
| Metal packages having improved thermal dissipation Grant 4,961,106 - Butt , et al. October 2, 1 | 1990-10-02 |
| Aluminum alloy semiconductor packages Grant 4,939,316 - Mahulikar , et al. July 3, 1 | 1990-07-03 |
| Semiconductor die attach system Grant 4,929,516 - Pryor , et al. May 29, 1 | 1990-05-29 |
| Metal electronic package Grant 4,897,508 - Mahulikar , et al. January 30, 1 | 1990-01-30 |
| Semiconductor package Grant 4,888,449 - Crane , et al. December 19, 1 | 1989-12-19 |
| Electronic packaging of components incorporating a ceramic-glass-metal composite Grant 4,882,212 - SinghDeo , et al. November 21, 1 | 1989-11-21 |
| Semiconductor die attach system Grant 4,872,047 - Fister , et al. October 3, 1 | 1989-10-03 |
| Hermetically sealed package Grant 4,821,151 - Pryor , et al. April 11, 1 | 1989-04-11 |
| Process for treating copper-nickel alloys for use in brazed assemblies and product Grant 4,799,973 - Mahulikar , et al. January 24, 1 | 1989-01-24 |
| Cermet substrate with spinel adhesion component Grant 4,793,967 - Pryor , et al. December 27, 1 | 1988-12-27 |
| Ceramic-glass-metal composite Grant 4,748,136 - Mahulikar , et al. May 31, 1 | 1988-05-31 |
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