Mahlkow; Hartmut

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mahlkow; Hartmut.The latest application filed is for "solution for etching copper surfaces and method of depositing metal on copper surfaces".

Company Profile

0.10.5

Mahlkow; Hartmut - Berlin DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Immersion plating of silver Grant 7,479,305 - Schreier , et al. January 20, 2	2009-01-20
Solution for etching copper surfaces and method of depositing metal on copper surfaces App 20060189141 - Mahlkow; Hartmut ; et al.	2006-08-24
Immersion plating of silver App 20060165909 - Schreier; Hans-Jurgen ; et al.	2006-07-27
Acidic solution for silver deposition and method for silver layer deposition on metal surfaces App 20050175780 - Sparing, Christian ; et al.	2005-08-11
Bath and method of electroless plating of silver on metal surfaces Grant 6,869,637 - Hutchinson , et al. March 22, 2	2005-03-22
Method for producing solderable and functional surfaces on circuit carriers Grant 6,698,648 - Wunderlich , et al. March 2, 2	2004-03-02
Bath and method of electroless plating of silver on metal surfaces App 20030157264 - Hutchinson, Carl ; et al.	2003-08-21
Method for producing solderable and functional surfaces on circuit carriers App 20030052157 - Wunderlich, Christian ; et al.	2003-03-20
Method and solution for producing gold coating Grant 6,336,962 - Backus , et al. January 8, 2	2002-01-08
palladium layers deposition process Grant 5,882,736 - Stein , et al. March 16, 1	1999-03-16
Method for coating surfaces with finely particulate materials Grant 5,705,219 - Besenhard , et al. January 6, 1	1998-01-06
Adhesive metallization of polyimide Grant 4,517,254 - Grapentin , et al. May 14, 1	1985-05-14
Method for producing printed circuits Grant 4,285,991 - Gedrat , et al. August 25, 1	1981-08-25
Process for preparation of metal patterns on insulating carrier materials Grant 4,262,085 - Ehrich , et al. April 14, 1	1981-04-14
Solution and process for the activation of surfaces for metallization Grant 4,248,632 - Ehrich , et al. February 3, 1	1981-02-03

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