Mahaney, Jr.; Howard Victor

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mahaney, Jr.; Howard Victor.The latest application filed is for "cooling system for electronic devices employing adjacent fan cages with interflow passages".

Company Profile

1.25.5

Mahaney, Jr.; Howard Victor - Cedar Park TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Cooling system for electronic devices employing adjacent fan cages with interflow passages Grant 10,257,957 - Barron , et al.	2019-04-09
Cooling system for electronic devices employing adjacent fan cages with interflow passages Grant 9,681,579 - Barron , et al. June 13, 2	2017-06-13
Cooling System For Electronic Devices Employing Adjacent Fan Cages With Interflow Passages App 20160366785 - BARRON; David Paul ; et al.	2016-12-15
Cooling System For Electronic Devices Employing Adjacent Fan Cages With Interflow Passages App 20160366784 - Barron; David Paul ; et al.	2016-12-15
Rack with integrated rear-door heat exchanger Grant 7,660,116 - Claassen , et al. February 9, 2	2010-02-09
Coolant Distribution System For A Rack Having A Rear-Door Heat Exchanger App 20090260384 - Champion; David Frederick ; et al.	2009-10-22
Rack With Integrated Rear-Door Heat Exchanger App 20090262501 - Claassen; Alan ; et al.	2009-10-22
Compact Optical Transceivers Including Thermal Distributing and Electromagnetic Shielding Systems and Methods Therefor App 20090087188 - Anderl; William James ; et al.	2009-04-02
Functional and stress testing of LGA devices Grant 7,479,796 - Corbin, Jr. , et al. January 20, 2	2009-01-20
Functional and stress testing of LGA devices Grant 7,466,155 - Corbin, Jr. , et al. December 16, 2	2008-12-16
Functional and stress testing of LGA devices Grant 7,463,017 - Corbin, Jr. , et al. December 9, 2	2008-12-09
Compact optical transceivers including thermal distributing and electromagnetic shielding systems and methods therefor Grant 7,458,733 - Anderl , et al. December 2, 2	2008-12-02
Functional and stress testing of LGA devices Grant 7,456,644 - Corbin, Jr. , et al. November 25, 2	2008-11-25
Functional and stress testing of LGA devices Grant 7,453,279 - Corbin, Jr. , et al. November 18, 2	2008-11-18
Functional and stress testing of LGA devices Grant 7,425,822 - Corbin, Jr. , et al. September 16, 2	2008-09-16
Functional and stress testing of LGA devices Grant 7,423,440 - Corbin, Jr. , et al. September 9, 2	2008-09-09
Functional and stress testing of LGA devices Grant 7,405,583 - Corbin, Jr. , et al. July 29, 2	2008-07-29
Functional and stress testing of LGA devices Grant 7,352,200 - Corbin, Jr. , et al. April 1, 2	2008-04-01
Compact optical transceivers including thermal distributing and electromagnetic shielding systems and methods thereof Grant 7,314,318 - Anderl , et al. January 1, 2	2008-01-01
System, apparatus and method for controlling temperature of an integrated circuit under test Grant 7,218,129 - Beaman , et al. May 15, 2	2007-05-15
Temperature and condensation control system for functional tester Grant 7,135,877 - Beaman , et al. November 14, 2	2006-11-14
Compact optical transceivers including thermal distributing and electromagnetic shielding systems and methods thereof Grant 7,073,960 - Anderl , et al. July 11, 2	2006-07-11
Apparatus for functional and stress testing of exposed chip land grid array devices Grant 6,911,836 - Cannon , et al. June 28, 2	2005-06-28
Common heatsink for multiple chips and modules Grant 6,661,661 - Gaynes , et al. December 9, 2	2003-12-09
Heated PCB interconnect for cooled IC chip modules Grant 6,246,581 - Kang , et al. June 12, 2	2001-06-12
Cooled IC chip modules with an insulated circuit board Grant 6,243,268 - Kang , et al. June 5, 2	2001-06-05
Dehumidified cooling assembly for IC chip modules Grant 6,233,959 - Kang , et al. May 22, 2	2001-05-22
High density heatsink attachment and method therefor Grant 6,180,874 - Brezina , et al. January 30, 2	2001-01-30
Moisture barrier seals for cooled IC chip module assemblies Grant 6,125,036 - Kang , et al. September 26, 2	2000-09-26
High density heatsink attachment Grant 5,808,236 - Brezina , et al. September 15, 1	1998-09-15

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