Mahalingam; L. M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mahalingam; L. M..The latest application filed is for "semiconductor devices with a thermally conductive layer and methods of their fabrication".

Company Profile

0.10.11

Mahalingam; L. M. - Scottsdale AZ
Mahalingam; L M - Scottsdale AZ US
Mahalingam; L. M. - Austin TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor devices with a thermally conductive layer and methods of their fabrication Grant 10,074,588 - Viswanathan , et al. September 11, 2	2018-09-11
Semiconductor Devices with a Thermally Conductive Layer and Methods of Their Fabrication App 20170207142 - Viswanathan; Lakshminarayan ; et al.	2017-07-20
Semiconductor devices with a thermally conductive layer Grant 9,614,046 - Viswanathan , et al. April 4, 2	2017-04-04
Semiconductor Devices With A Thermally Conductive Layer App 20160308010 - Viswanathan; Lakshminarayan ; et al.	2016-10-20
Semiconductor device with mechanical lock features between a semiconductor die and a substrate Grant 9,425,161 - Viswanathan , et al. August 23, 2	2016-08-23
Semiconductor devices with a thermally conductive layer and methods of their fabrication Grant 9,362,198 - Viswanathan , et al. June 7, 2	2016-06-07
Packaged RF amplifier devices and methods of manufacture thereof Grant 9,337,774 - Szymanowski , et al. May 10, 2	2016-05-10
Packaged Rf Amplifier Devices And Methods Of Manufacture Thereof App 20160087586 - SZYMANOWSKI; MARGARET A. ; et al.	2016-03-24
Semiconductor Device With Mechanical Lock Features Between A Semiconductor Die And A Substrate App 20150333031 - VISWANATHAN; LAKSHMINARAYAN ; et al.	2015-11-19
Semiconductor Devices With A Thermally Conductive Layer And Methods Of Their Fabrication App 20150294921 - VISWANATHAN; LAKSHMINARAYAN ; et al.	2015-10-15
Packaged semiconductor devices and methods of their fabrication Grant 9,099,567 - Viswanathan , et al. August 4, 2	2015-08-04
Packaged Semiconductor Devices And Methods Of Their Fabrication App 20150146399 - VISWANATHAN; LAKSHMINARAYAN ; et al.	2015-05-28
Heatsink moldlocks Grant 8,310,042 - Elliott , et al. November 13, 2	2012-11-13
Semiconductor device with a buffer region with tightly-packed filler particles Grant 7,701,074 - Condie , et al. April 20, 2	2010-04-20
Heatsink Moldlocks App 20060220187 - Elliott; Alexander J. ; et al.	2006-10-05
High impedance radio frequency power plastic package App 20040241913 - Mclaughlin, Robert J. ; et al.	2004-12-02
Miniature moldlocks for heatsink or flag for an overmolded plastic package App 20040113262 - Elliott, Alexander J. ; et al.	2004-06-17

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