MAHAJAN; Ravi V.

Patent Applications and Registrations

Patent applications and USPTO patent grants for MAHAJAN; Ravi V..The latest application filed is for "localized high density substrate routing".

Company Profile

1.20.18

MAHAJAN; Ravi V. - Chandler AZ
Mahajan; Ravi V. - Tempe AZ US
Mahajan; Ravi V. - Tempte AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Localized High Density Substrate Routing App 20200395297 - STARKSTON; Robert ; et al.	2020-12-17
Localized high density substrate routing Grant 10,796,988 - Starkston , et al. October 6, 2	2020-10-06
Electronic assembly that includes stacked electronic devices Grant 9,941,246 - Deshpande , et al. April 10, 2	2018-04-10
Flexible electronic assembly method Grant 9,820,384 - Oster , et al. November 14, 2	2017-11-14
Electronic Assembly That Includes Stacked Electronic Devices App 20160260688 - Deshpande; Nitin ; et al.	2016-09-08
Localized high density substrate routing Grant 9,269,701 - Starkston , et al. February 23, 2	2016-02-23
Localized High Density Substrate Routing App 20150340353 - Starkston; Robert ; et al.	2015-11-26
Localized high density substrate routing Grant 9,136,236 - Starkston , et al. September 15, 2	2015-09-15
Flexible Microelectronic Assembly And Method App 20150187681 - Mahajan; Ravi V. ; et al.	2015-07-02
Flexible Electronic Assembly And Method App 20150163921 - Oster; Sasha ; et al.	2015-06-11
Localized High Density Substrate Routing App 20140091474 - Starkston; Robert ; et al.	2014-04-03
Process for assembling an integrated circuit package having a substrate vent hole Grant RE44,629 - Ramalingam , et al. December 10, 2	2013-12-10
Method of forming electronic package having fluid-conducting channel Grant 7,882,624 - Hu , et al. February 8, 2	2011-02-08
Microelectronic package and method of cooling an interconnect feature in same Grant 7,851,905 - Chrysler , et al. December 14, 2	2010-12-14
Microelectronic Package And Method Of Cooling An Interconnect Feature In Same App 20090079063 - Chrysler; Gregory M. ; et al.	2009-03-26
Computer system having controlled cooling Grant 7,508,671 - Sauciuc , et al. March 24, 2	2009-03-24
Microelectronic die having a thermoelectric module Grant 7,279,796 - Hu , et al. October 9, 2	2007-10-09
Electronic packages, assemblies, and systems with fluid cooling Grant 7,126,822 - Hu , et al. October 24, 2	2006-10-24
Electronic packages, assemblies, and systems with fluid cooling and associated methods App 20060139883 - Hu; Chuan ; et al.	2006-06-29
Method of providing a heat spreader App 20060127672 - Chrysler; Gregory M. ; et al.	2006-06-15
Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme Grant 6,908,845 - Swan , et al. June 21, 2	2005-06-21
Computer system having controlled cooling App 20050078451 - Sauciuc, Ioan ; et al.	2005-04-14
Microelectronic die having a thermoelectric module App 20050029637 - Hu, Chuan ; et al.	2005-02-10
Electronic assembly with fluid cooling and associated methods App 20040190254 - Hu, Chuan ; et al.	2004-09-30
Electronic assembly with high capacity thermal spreader and methods of manufacture Grant 6,706,562 - Mahajan , et al. March 16, 2	2004-03-16
Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme App 20030186486 - Swan, Johanna M. ; et al.	2003-10-02
Diamond integrated heat spreader and method of manufacturing same App 20030152773 - Chrysler, Gregory M. ; et al.	2003-08-14
Integrated circuit package having a substrate vent hole Grant 6,490,166 - Ramalingam , et al. December 3, 2	2002-12-03
Electronic assembly with high capacity thermal spreader and methods of manufacture App 20020105071 - Mahajan, Ravi V. ; et al.	2002-08-08
Substrate for reducing electromagnetic interference and enclosure Grant 6,191,475 - Skinner , et al. February 20, 2	2001-02-20
EMI containment for microprocessor core mounted on a card using surface mounted clips Grant 6,043,983 - Taylor , et al. March 28, 2	2000-03-28
Cartridge and an enclosure for a semiconductor package Grant 6,011,696 - Mahajan , et al. January 4, 2	2000-01-04
C4 package die backside coating Grant 5,936,304 - Lii , et al. August 10, 1	1999-08-10

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