Mahajan; Ravi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mahajan; Ravi.The latest application filed is for "microelectronic package containing silicon connecting region for high density interconnects, and method of manufacturing same".

Company Profile

0.13.14

Mahajan; Ravi - Chandler AZ US
Mahajan; Ravi - Tempe AZ
Mahajan; Ravi - Phoenix AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate Grant 9,941,245 - Skeete , et al. April 10, 2	2018-04-10
Microelectronic package containing silicon connecting region for high density interconnects, and method of manufacturing same Grant 8,441,809 - Mahajan , et al. May 14, 2	2013-05-14
Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same Grant 8,064,224 - Mahajan , et al. November 22, 2	2011-11-22
Microelectronic Package Containing Silicon Connecting Region For High Density Interconnects, And Method Of Manufacturing Same App 20110241208 - Mahajan; Ravi ; et al.	2011-10-06
Integrated Circuit Packages Including High Density Bump-less Build Up Layers And A Lesser Density Core Or Coreless Substrate App 20110101491 - SKEETE; OSWALD ; et al.	2011-05-05
Electromagnetically-actuated micropump for liquid metal alloy Grant 7,764,499 - Sauciuc , et al. July 27, 2	2010-07-27
Microelectronic Package Containing Silicon Patches For High Density Interconnects, And Method Of Manufacturing Same App 20090244874 - Mahajan; Ravi ; et al.	2009-10-01
Electromagnetically-actuated micropump for liquid metal alloy App 20090237884 - Sauciuc; loan ; et al.	2009-09-24
Using external radiators with electroosmotic pumps for cooling integrated circuits Grant 7,576,432 - Kim , et al. August 18, 2	2009-08-18
Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewalls Grant 7,539,016 - Sauciuc , et al. May 26, 2	2009-05-26
Enabling Bare Die Liquid Cooling For The Bare Die And Hot Spots App 20090084931 - Sauciuc; Ioan ; et al.	2009-04-02
Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewalls App 20070164427 - Sauciuc; Ioan ; et al.	2007-07-19
Using external radiators with electroosmotic pumps for cooling integrated circuits App 20060055030 - Kim; Sarah E. ; et al.	2006-03-16
Using external radiators with electroosmotic pumps for cooling integrated circuits Grant 6,992,381 - Kim , et al. January 31, 2	2006-01-31
Micro-channel heat exchangers and spreaders Grant 6,934,154 - Prasher , et al. August 23, 2	2005-08-23
Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink Grant 6,903,929 - Prasher , et al. June 7, 2	2005-06-07
Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling App 20050117300 - Prasher, Ravi ; et al.	2005-06-02
Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling App 20050117301 - Prasher, Ravi ; et al.	2005-06-02
Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling App 20050117299 - Prasher, Ravi ; et al.	2005-06-02
Using external radiators with electroosmotic pumps for cooling integrated circuits App 20050093138 - Kim, Sarah E. ; et al.	2005-05-05
Channeled heat sink and chassis with integrated heat rejector for two-phase cooling App 20040190253 - Prasher, Ravi ; et al.	2004-09-30
Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink App 20040190251 - Prasher, Ravi ; et al.	2004-09-30
Micro-channel heat exchangers and spreaders App 20040190252 - Prasher, Ravi ; et al.	2004-09-30
Partial underfill for flip-chip electronic packages Grant 6,700,209 - Raiser , et al. March 2, 2	2004-03-02
Organic substrate (PCB) slip plane "stress deflector" for flip chip deivces Grant 5,804,771 - McMahon , et al. September 8, 1	1998-09-08

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