Magnuson; Roy H.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Magnuson; Roy H..The latest application filed is for "electrically conductive adhesive (eca) for multilayer device interconnects".

Company Profile

0.30.22

Magnuson; Roy H. - Endicott NY US
Magnuson, Roy H - Endicott NY
Magnuson; Roy H. - Binghamton NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrically conductive adhesive (ECA) for multilayer device interconnects Grant 9,451,693 - Das , et al. September 20, 2	2016-09-20
Conducting paste for device level interconnects Grant 8,685,284 - Das , et al. April 1, 2	2014-04-01
Electrically Conductive Adhesive (eca) For Multilayer Device Interconnects App 20130033827 - Das; Rabindra N. ; et al.	2013-02-07
Conducting Paste For Device Level Interconnects App 20120069531 - Das; Rabindra N. ; et al.	2012-03-22
Circuitized substrate with internal cooling structure and electrical assembly utilizing same Grant 7,738,249 - Chan , et al. June 15, 2	2010-06-15
Method of making circuitized substrate with internal optical pathway using photolithography Grant 7,713,767 - Chan , et al. May 11, 2	2010-05-11
Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same Grant 7,679,005 - Chan , et al. March 16, 2	2010-03-16
Photoresist composition with antibacterial agent Grant 7,635,552 - Keesler , et al. December 22, 2	2009-12-22
Circuitized substrate and method of making same App 20090241332 - Lauffer; John M. ; et al.	2009-10-01
Fabrication of silicon micro-mechanical structures Grant 7,566,939 - Despont , et al. July 28, 2	2009-07-28
Method of making circuitized substrate with internal optical pathway Grant 7,541,058 - Chan , et al. June 2, 2	2009-06-02
Circuitized substrate with internal cooling structure and electrical assembly utilizing same App 20090109624 - Chan; Benson ; et al.	2009-04-30
Method of making circuitized substrate with internal optical pathway using photolithography App 20090093073 - Chan; Benson ; et al.	2009-04-09
Method of making circuitized substrate with internal optical pathway App 20090092353 - Chan; Benson ; et al.	2009-04-09
Adhesive bleed prevention method and product produced from same App 20090035455 - Magnuson; Roy H. ; et al.	2009-02-05
Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate Grant 7,442,879 - Das , et al. October 28, 2	2008-10-28
Method of forming printed circuit card Grant 7,353,590 - Fallon , et al. April 8, 2	2008-04-08
Photoresist composition with antibacterial agent App 20080026316 - Keesler; Ross W. ; et al.	2008-01-31
Plating method for circuitized substrates Grant 7,169,313 - Card , et al. January 30, 2	2007-01-30
Circuitized substrate with soler-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate App 20070007033 - Das; Rabindra N. ; et al.	2007-01-11
Plating method for circuitized substrates App 20060255009 - Card; Norman A. ; et al.	2006-11-16
Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same App 20060214010 - Chan; Benson ; et al.	2006-09-28
Method of making printed circuit board with varying depth conductive holes adapted for receiving pinned electrical components App 20060121722 - Card; Norman A. ; et al.	2006-06-08
Method of forming printed circuit card Grant 6,986,198 - Fallon , et al. January 17, 2	2006-01-17
Method of forming printed circuit card App 20060005383 - Fallon; Kenneth ; et al.	2006-01-12
Fabrication of silicon micro-mechanical structures App 20050230839 - Despont, Michel ; et al.	2005-10-20
Fabrication of silicon micro mechanical structures Grant 6,949,397 - Despont , et al. September 27, 2	2005-09-27
Colloidal seed formation for printed circuit board metallization App 20050042383 - Galasco, Raymond T. ; et al.	2005-02-24
Colloidal seed formulation for printed circuit board metallization Grant 6,852,152 - Galasco , et al. February 8, 2	2005-02-08
Two signal one power plane circuit board App 20040134685 - Fallon, Kenneth ; et al.	2004-07-15
Fabrication of silicon micro mechanical structures App 20040135219 - Despont, Michel ; et al.	2004-07-15
Two signal one power plane circuit board Grant 6,750,405 - Fallon , et al. June 15, 2	2004-06-15
Colloidal seed formation for printed circuit board metallization App 20040058071 - Galasco, Raymond T. ; et al.	2004-03-25
Dielectric structure and method of formation Grant 6,699,350 - Bhatt , et al. March 2, 2	2004-03-02
Copper plated PTH barrels and methods for fabricating App 20030209799 - Magnuson, Roy H. ; et al.	2003-11-13
Copper plated PTH barrels and methods for fabricating Grant 6,630,743 - Magnuson , et al. October 7, 2	2003-10-07
Dielectric structure and method of formation App 20030010440 - Bhatt, Anilkumar C. ; et al.	2003-01-16
Copper plated PTH barrels and methods for fabricating App 20020195716 - Magnuson, Roy H. ; et al.	2002-12-26
Method of preparing a printed circuit board Grant RE37,840 - Bhatt , et al. September 17, 2	2002-09-17
Two signal one power plane circuit board Grant 6,204,453 - Fallon , et al. March 20, 2	2001-03-20
Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectric Grant 6,201,194 - Lauffer , et al. March 13, 2	2001-03-13
Method of preparing a printed circuit board Grant 5,557,844 - Bhatt , et al. September 24, 1	1996-09-24
Method for making printed circuit boards with selectivity filled plated through holes Grant 5,487,218 - Bhatt , et al. January 30, 1	1996-01-30
Semi-subtractive circuitization Grant 5,427,895 - Magnuson , et al. June 27, 1	1995-06-27
Electroless plating with bi-level control of dissolved oxygen, with specific location of chemical maintenance means Grant 4,967,690 - Fey , et al. November 6, 1	1990-11-06
Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon Grant 4,948,707 - Johnson , et al. August 14, 1	1990-08-14
Electroless plating with bi-level control of dissolved oxygen Grant 4,684,545 - Fey , et al. August 4, 1	1987-08-04
Determination of amount of anionic material in a liquid sample Grant 4,666,858 - Magnuson , et al. May 19, 1	1987-05-19
Method for controlling plating rate in an electroless plating system Grant 4,623,554 - Kaschak , et al. November 18, 1	1986-11-18

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