Magno; Sheila Rima C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Magno; Sheila Rima C..The latest application filed is for "integrated circuit packaging system with etched ring and die paddle and method of manufacture thereof".

Company Profile

0.10.9

Magno; Sheila Rima C. - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit package system with multi-surface die attach pad Grant 8,536,689 - Dimaano, Jr. , et al. September 17, 2	2013-09-17
Integrated circuit package system with filled wafer recess Grant 8,293,584 - Guillermo , et al. October 23, 2	2012-10-23
Integrated circuit packaging system with etched ring and die paddle and method of manufacture thereof Grant 7,863,108 - Dimaano, Jr. , et al. January 4, 2	2011-01-04
Integrated Circuit Packaging System With Etched Ring And Die Paddle And Method Of Manufacture Thereof App 20090230529 - Dimaano, JR.; Antonio B. ; et al.	2009-09-17
Method of fabricating an integrated circuit with etched ring and die paddle Grant 7,556,987 - Dimaano, Jr. , et al. July 7, 2	2009-07-07
Wire sweep resistant semiconductor package and manufacturing method therefor Grant 7,541,222 - Magno , et al. June 2, 2	2009-06-02
Semiconductor package with controlled solder bump wetting Grant 7,352,055 - Shim , et al. April 1, 2	2008-04-01
Integrated Circuit Package System With Filled Recess App 20080029847 - Guillermo; Dennis ; et al.	2008-02-07
Integrated Circuit Package System App 20080001263 - Dimaano; Antonio B. ; et al.	2008-01-03
Semiconductor Package With Controlled Solder Bump Wetting App 20070090537 - Shim; Il Kwon ; et al.	2007-04-26
Integrated Circuit Package System With Multi-surface Die Attach Pad App 20070075404 - Dimaano; Antonio B. JR. ; et al.	2007-04-05
Wire Sweep Resistant Semiconductor Package And Manufacturing Method Thereof App 20070063354 - Magno; Sheila Rima C. ; et al.	2007-03-22
Semiconductor package with controlled solder bump wetting and fabrication method therefor Grant 7,148,086 - Shim , et al. December 12, 2	2006-12-12
Air pocket resistant semiconductor package Grant 7,141,886 - Dimaano, Jr. , et al. November 28, 2	2006-11-28
Semiconductor Package With Controlled Solder Bump Wetting And Fabrication Method Therefor App 20060246629 - Shim; IL Kwon ; et al.	2006-11-02
Wire sweep resistant semiconductor package and manufacturing method thereof App 20060043612 - Magno; Sheila Rima C. ; et al.	2006-03-02
Air pocket resistant semiconductor package App 20060043564 - Dimaano; Antonio B. JR. ; et al.	2006-03-02
Air pocket resistant semiconductor package system Grant 6,969,640 - Dimaano Jr. , et al. November 29, 2	2005-11-29

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.