Magic Corporation
Patent Applications and Registrations
Patent applications and USPTO patent grants for Magic Corporation.The latest application filed is for "top layers of metal for high performance ic's".
- Magic Corporation - Hsin-Chu TW
| Patent | Date |
|---|---|
| Top layers of metal for high performance IC's Grant 6,657,310 - Lin December 2, 2 | 2003-12-02 |
| Structure of high performance combo chip and processing method Grant 6,613,606 - Lee September 2, 2 | 2003-09-02 |
| Post passivation interconnection schemes on top of the IC chips Grant 6,495,442 - Lin , et al. December 17, 2 | 2002-12-17 |
| NCAGE Code | 09YB8 | MAGIC CORP |
| CAGE Code | 09YB8 | MAGIC CORP |
| SEC | 0000934113 | MAGIC CORP |
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