Maghsoudnia; Mozafar
Patent Applications and Registrations
Patent applications and USPTO patent grants for Maghsoudnia; Mozafar.The latest application filed is for "assembly and packaging of mems device".
- Maghsoudnia; Mozafar - San Jose CA
| Patent | Date |
|---|---|
| 3D integration using Al--Ge eutectic bond interconnect Grant 10,651,151 - Smeys , et al. | 2020-05-12 |
| Assembly and packaging of MEMS device Grant 10,472,231 - Kim , et al. Nov | 2019-11-12 |
| Assembly And Packaging Of Mems Device App 20190308874 - Kim; Brian H. ; et al. | 2019-10-10 |
| Integrated package containing MEMS acoustic sensor and pressure sensor Grant 10,351,419 - Gao , et al. July 16, 2 | 2019-07-16 |
| Integrated Package Containing Mems Acoustic Sensor And Pressure Sensor App 20170334714 - Gao; Jia ; et al. | 2017-11-23 |
| 3D INTEGRATION USING Al-Ge EUTECTIC BOND INTERCONNECT App 20170330863 - Smeys; Peter ; et al. | 2017-11-16 |
| 3D integration using Al--Ge eutectic bond interconnect Grant 9,754,922 - Smeys , et al. September 5, 2 | 2017-09-05 |
| MEMS sensor integrated with a flip chip Grant 9,611,137 - Smeys , et al. April 4, 2 | 2017-04-04 |
| Assembly And Packaging Of Mems Device App 20170044007 - Kim; Brian H. ; et al. | 2017-02-16 |
| Assembly and packaging of MEMS device Grant 9,508,663 - Kim , et al. November 29, 2 | 2016-11-29 |
| 3D INTEGRATION USING Al-Ge EUTECTIC BOND INTERCONNECT App 20160233197 - Smeys; Peter ; et al. | 2016-08-11 |
| Mems Sensor Integrated With A Flip Chip App 20160060100 - SMEYS; Peter ; et al. | 2016-03-03 |
| Assembly And Packaging Of Mems Device App 20150028432 - Kim; Brian H. ; et al. | 2015-01-29 |
| Transistor with spatially integrated schottky diode Grant 7,808,223 - Khanna , et al. October 5, 2 | 2010-10-05 |
| SEC | 0001385552 | Maghsoudnia Mozafar |
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