| Patent | Date |
|---|
Semiconductor package structures having liquid cooler integrated with first level chip package modules
Grant 8,772,927 - Bezama , et al. July 8, 2 | 2014-07-08 |
Structure and apparatus for cooling integrated circuits using copper microchannels
Grant 8,505,617 - Bezama , et al. August 13, 2 | 2013-08-13 |
Stacked and redundant chip coolers
Grant 8,418,751 - Bezama , et al. April 16, 2 | 2013-04-16 |
Structure and Apparatus for Cooling Integrated Circuits Using Copper Microchannels
App 20120175100 - Bezama; Raschid Jose ; et al. | 2012-07-12 |
Structure and apparatus for cooling integrated circuits using cooper microchannels
Grant 8,210,243 - Bezama , et al. July 3, 2 | 2012-07-03 |
Semiconductor Package Structures Having Liquid Cooler Integrated with First Level Chip Package Modules
App 20120049341 - Bezama; Raschid Jose ; et al. | 2012-03-01 |
Semiconductor package structures having liquid coolers integrated with first level chip package modules
Grant 8,115,303 - Bezama , et al. February 14, 2 | 2012-02-14 |
Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer
Grant 7,880,305 - Cheng , et al. February 1, 2 | 2011-02-01 |
Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirements
Grant 7,808,781 - Colgan , et al. October 5, 2 | 2010-10-05 |
Versatile Si-based packaging with integrated passive components for mmWave applications
Grant 7,808,798 - Cotte , et al. October 5, 2 | 2010-10-05 |
Structure and Apparatus for Cooling Integrated Circuits Using Cooper Microchannels
App 20100012294 - Bezama; Raschid Jose ; et al. | 2010-01-21 |
Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer
App 20090302454 - Cheng; Yu- Ting ; et al. | 2009-12-10 |
Apparatus and Methods for High-Performance Liquid Cooling of Multiple Chips with Disparate Cooling Requirements
App 20090284921 - Colgan; Evan George ; et al. | 2009-11-19 |
Stacked and Redundant Chip Coolers
App 20090283244 - Bezama; Raschid Jose ; et al. | 2009-11-19 |
Semiconductor Package Structures Having Liquid Coolers Integrated with First Level Chip Package Modules
App 20090283902 - Bezama; Raschid Jose ; et al. | 2009-11-19 |
Versatile Si-based packaging with integrated passive components for mmWave applications
Grant 7,518,229 - Cotte , et al. April 14, 2 | 2009-04-14 |
Space transforming land grid array interposers
Grant 7,473,102 - Colgan , et al. January 6, 2 | 2009-01-06 |
VERSATILE Si-BASED PACKAGING WITH INTEGRATED PASSIVE COMPONENTS FOR mmWAVE APPLICATIONS
App 20080186247 - Cotte; John Michael ; et al. | 2008-08-07 |
Versatile Si-based packaging with integrated passive components for mmWave applications
App 20080029886 - Cotte; John Michael ; et al. | 2008-02-07 |
Space transforming land grid array interposers
App 20070232090 - Colgan; Evan George ; et al. | 2007-10-04 |
Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages
Grant 7,190,580 - Bezama , et al. March 13, 2 | 2007-03-13 |
Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages
Grant 7,139,172 - Bezama , et al. November 21, 2 | 2006-11-21 |
Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages
App 20060002088 - Bezama; Raschid Jose ; et al. | 2006-01-05 |
Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages
App 20060002087 - Bezama; Raschid Jose ; et al. | 2006-01-05 |
High density area array solder microjoining interconnect structure and fabrication method
Grant 6,819,000 - Magerlein , et al. November 16, 2 | 2004-11-16 |
Chip cooling
Grant 6,774,482 - Colgan , et al. August 10, 2 | 2004-08-10 |
Chip Cooling
App 20040124525 - Colgan, Evan George ; et al. | 2004-07-01 |
Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same
Grant 6,747,472 - Magerlein , et al. June 8, 2 | 2004-06-08 |
Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer
App 20040089948 - Cheng, Yu-Ting ; et al. | 2004-05-13 |
High density raised stud microjoining system and methods of fabricating the same
Grant 6,732,908 - Furman , et al. May 11, 2 | 2004-05-11 |
High density area array solder microjoining interconnect structure and fabrication method
App 20040084782 - Magerlein, John Harold ; et al. | 2004-05-06 |
High density area array solder microjoining interconnect structure and fabrication method
Grant 6,661,098 - Magerlein , et al. December 9, 2 | 2003-12-09 |
Combined resistor-capacitor elements for decoupling in electronic packages
Grant 6,657,291 - Magerlein , et al. December 2, 2 | 2003-12-02 |
Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same
App 20030136813 - Magerlein, John Harold ; et al. | 2003-07-24 |
High density area array solder microjoining interconnect structure and fabrication method
App 20030137058 - Magerlein, John Harold ; et al. | 2003-07-24 |
High density raised stud microjoining system and methods of fabricating the same
App 20030136814 - Furman, Bruce Kenneth ; et al. | 2003-07-24 |
System of a package fabricated on a semiconductor or dielectric wafer with wiring on one face, vias extending through the wafer, and external connections on the opposing face
Grant 6,593,644 - Chiu , et al. July 15, 2 | 2003-07-15 |
System of a package fabricated on a semiconductor or dielectric wafer
App 20020153603 - Chiu, George Laing-Tai ; et al. | 2002-10-24 |
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