Magerlein; John H.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Magerlein; John H..The latest application filed is for "silicon based microchannel cooling and electrical package".

Company Profile

0.15.15

Magerlein; John H. - Yorktown Heights NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Silicon based microchannel cooling and electrical package Grant 8,581,392 - Knickerbocker , et al. November 12, 2	2013-11-12
Silicon Based Microchannel Cooling And Electrical Package App 20130092938 - Knickerbocker; John Ulrich ; et al.	2013-04-18
Silicon based microchannel cooling and electrical package Grant 8,421,220 - Knickerbocker , et al. April 16, 2	2013-04-16
Silicon Based Microchannel Cooling And Electrical Package App 20120133051 - Knickerbocker; John Ulrich ; et al.	2012-05-31
Silicon based microchannel cooling and electrical package Grant 8,110,415 - Knickerbocker , et al. February 7, 2	2012-02-07
Method and manufacture of silicon based package and devices manufactured thereby Grant 8,097,492 - Magerlein , et al. January 17, 2	2012-01-17
Double-face Heat Removal Of Vertically Integrated Chip-stacks Utilizing Combined Symmetric Silicon Carrier Fluid Cavity And Micro-channel Cold Plate App 20110205708 - Andry; Paul S. ; et al.	2011-08-25
Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plate Grant 7,990,711 - Andry , et al. August 2, 2	2011-08-02
Segmentation of a die stack for 3D packaging thermal management Grant 7,928,562 - Arvelo , et al. April 19, 2	2011-04-19
Silicon based package Grant 7,855,442 - Magerlein , et al. December 21, 2	2010-12-21
Method of fabricating a high Q factor integrated circuit inductor Grant 7,829,427 - Edelstein , et al. November 9, 2	2010-11-09
Method Of Fabricating A High Q Factor Integrated Circuit Inductor App 20100047990 - Edelstein; Daniel C. ; et al.	2010-02-25
Segmentation Of A Die Stack For 3d Packaging Thermal Management App 20100019377 - Arvelo; Amilcar R. ; et al.	2010-01-28
Method of fabricating a high Q factor integrated circuit inductor Grant 7,638,406 - Edelstein , et al. December 29, 2	2009-12-29
Silicon Based Microchannel Cooling And Electrical Package App 20090251862 - Knickerbocker; John Ulrich ; et al.	2009-10-08
Method of forming noble metal contacts Grant 7,581,314 - Deligianni , et al. September 1, 2	2009-09-01
Method And Manufacture Of Silicon Based Package And Devices Manufactured Thereby App 20090174059 - Magerlein; John H. ; et al.	2009-07-09
Method of manufacture of silicon based package and devices manufactured thereby App 20070111385 - Magerlein; John H. ; et al.	2007-05-17
Noble metal contacts for micro-electromechanical switches Grant 7,202,764 - Deligianni , et al. April 10, 2	2007-04-10
Method of manufacture of silicon based package and devices manufactured thereby Grant 7,189,595 - Magerlein , et al. March 13, 2	2007-03-13
Method and apparatus for providing optoelectronic communication with an electronic device Grant 7,128,472 - Benner , et al. October 31, 2	2006-10-31
Noble metal contacts for micro-electromechanical switches App 20060164194 - Deligianni; Hariklia ; et al.	2006-07-27
High Q factor integrated circuit inductor Grant 7,068,138 - Edelstein , et al. June 27, 2	2006-06-27
High Q factor integrated circuit inductor App 20060105534 - Edelstein; Daniel C. ; et al.	2006-05-18
High Q factor integrated circuit inductor App 20050167780 - Edelstein, Daniel C. ; et al.	2005-08-04
Local reduction of compliant thermally conductive material layer thickness on chips App 20050127500 - Colgan, Evan G. ; et al.	2005-06-16
Method and apparatus for providing optoelectronic communication with an electronic device App 20050025434 - Benner, Alan F. ; et al.	2005-02-03
Noble Metal Contacts For Micro-electromechanical Switches App 20050007217 - Deligianni, Hariklia ; et al.	2005-01-13
Method of manufacture of silicon based package and devices manufactured thereby App 20040229398 - Magerlein, John H. ; et al.	2004-11-18

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