Magaya; Tafadzwa
Patent Applications and Registrations
Patent applications and USPTO patent grants for Magaya; Tafadzwa.The latest application filed is for "novel method for electromagnetic shielding and thermal management of active components".
- Magaya; Tafadzwa - Englewood CO
- MAGAYA; Tafadzwa - Denver CO
- Magaya; Tafadzwa - Berlin N/A DE
| Patent | Date |
|---|---|
| Method for electromagnetic shielding and thermal management of active components Grant 10,249,572 - Mukai , et al. | 2019-04-02 |
| Novel Method For Electromagnetic Shielding And Thermal Management Of Active Components App 20170330861 - MUKAI; Kenichiroh ; et al. | 2017-11-16 |
| Novel Adhesion Promoting Agents For Metallisation Of Substrate Surfaces App 20160237571 - LIU; Zhiming ; et al. | 2016-08-18 |
| Electrolytic method for filling holes and cavities with metals Grant 8,784,634 - Reents , et al. July 22, 2 | 2014-07-22 |
| Electrolytic Method For Filling Holes and Cavities With Metals App 20090301889 - Reents; Bert ; et al. | 2009-12-10 |
| Method of electroplating a workpiece having high-aspect ratio holes App 20060151328 - Reents; Bert ; et al. | 2006-07-13 |
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