Maesato; Hidetoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Maesato; Hidetoshi.The latest application filed is for "method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions".

Company Profile

0.4.4

Maesato; Hidetoshi - Sakata-shi JP
Maesato; Hidetoshi - Sakata JP
Maesato; Hidetoshi - Yamagata JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions App 20060246314 - Osada; Mitsuo ; et al.	2006-11-02
Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions Grant 7,083,759 - Osada , et al. August 1, 2	2006-08-01
Semiconductor package and method for producing heat-radiating substrate for it Grant 6,926,861 - Hirayama , et al. August 9, 2	2005-08-09
Semiconductor package and method for producing heat-radiating substrate for it App 20040056352 - Hirayama, Norio ; et al.	2004-03-25
Semiconductor package and method for producing heat-radiating substrate for it Grant 6,693,353 - Hirayama , et al. February 17, 2	2004-02-17
Material of heat-dissipating plate on which semiconductor is mounted, method for fabricating the same, and ceramic package produced by using the same App 20020191377 - Osada, Mitsuo ; et al.	2002-12-19
Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same App 20020017346 - Osada, Mitsuo ; et al.	2002-02-14
Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same Grant 6,271,585 - Osada , et al. August 7, 2	2001-08-07

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