Maesaka; Michinobu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Maesaka; Michinobu.The latest application filed is for "apparatus having an electronic component located on a surface of a package member with a space therebetween".
- Maesaka; Michinobu - Omihachiman JP
- Maesaka, Michinobu - Omihachiman-shi JP
- Maesaka; Michinobu - Kyoto JP
- Maesaka; Michinobu - Nagaokakyo JP
| Patent | Date |
|---|---|
| Method of forming an electronic component located on a surface of a package member with a space therebetween Grant 6,871,388 - Ishino , et al. March 29, 2 | 2005-03-29 |
| Apparatus having an electronic component located on a surface of a package member with a space therebetween App 20030076010 - Ishino, Satoshi ; et al. | 2003-04-24 |
| Apparatus having an electronic component located on a surface of a package member with a space therebetween Grant 6,507,139 - Ishino , et al. January 14, 2 | 2003-01-14 |
| Sealing structure and method of sealing electronic component Grant 5,886,457 - Maesaka , et al. March 23, 1 | 1999-03-23 |
| Electronic component and method of producing same Grant 5,880,553 - Okeshi , et al. March 9, 1 | 1999-03-09 |
| Electronic component Grant 5,875,099 - Maesaka , et al. February 23, 1 | 1999-02-23 |
| Electric double-layer capacitor Grant 4,803,597 - Watanabe , et al. February 7, 1 | 1989-02-07 |
| Electrolytic double-layer capacitor Grant 4,783,723 - Watanabe , et al. November 8, 1 | 1988-11-08 |
| Molded carbonaceous material Grant 4,717,595 - Watanabe , et al. January 5, 1 | 1988-01-05 |
| Electric double layer capacitor Grant 4,697,224 - Watanabe , et al. September 29, 1 | 1987-09-29 |
| Method of manufacturing an electrolytic double-layer capacitor Grant 4,683,639 - Maesaka , et al. August 4, 1 | 1987-08-04 |
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