Maerz; Josef

Patent Applications and Registrations

Patent applications and USPTO patent grants for Maerz; Josef.The latest application filed is for "stacked transistor chip package with source coupling".

Company Profile

10.7.11

Maerz; Josef - Oberhaching DE
Maerz; Josef - Munich DE
Maerz; Josef - Munchen DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor assembly with conductive frame for I/O standoff and thermal dissipation Grant 11,393,743 - Cardwell , et al. July 19, 2	2022-07-19
Stacked Transistor Chip Package With Source Coupling App 20220122906 - YUFEREV; Sergey ; et al.	2022-04-21
Double-sided cooled molded semiconductor package Grant 11,302,613 - Chiang , et al. April 12, 2	2022-04-12
Semiconductor Assembly with Conductive Frame for I/O Standoff and Thermal Dissipation App 20210193560 - Cardwell; Stuart ; et al.	2021-06-24
Semiconductor Package Having A Lead Frame And A Clip Frame App 20210166998 - Scharf; Thorsten ; et al.	2021-06-03
Power Electronic Assembly and Method of Producing Thereof App 20210127490 - Palm; Petteri ; et al.	2021-04-29
Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture Grant 10,964,628 - Scharf , et al. March 30, 2	2021-03-30
Molded Semiconductor Package with Double-Sided Cooling App 20210020547 - Chiang; Chau Fatt ; et al.	2021-01-21
Double-Sided Cooled Molded Semiconductor Package App 20210020550 - Chiang; Chau Fatt ; et al.	2021-01-21
Molded semiconductor package with double-sided cooling Grant 10,886,199 - Chiang , et al. January 5, 2	2021-01-05
Semiconductor package having a filled conductive cavity Grant 10,770,399 - Ng , et al. Sep	2020-09-08
Clip Frame Assembly, Semiconductor Package Having a Lead Frame and a Clip Frame, and Method of Manufacture App 20200273781 - Scharf; Thorsten ; et al.	2020-08-27
Clip Frame Assembly, Semiconductor Package Having a Lead Frame and a Clip Frame, and Method of Manufacture App 20200273790 - Tay; Bun Kian ; et al.	2020-08-27
Semiconductor Package Having a Filled Conductive Cavity App 20200258842 - A1	2020-08-13
Semiconductor arrangement Grant 7,498,194 - Bott , et al. March 3, 2	2009-03-03
Semiconductor Arrangement App 20070178624 - Bott; Nikolaus ; et al.	2007-08-02
Semiconductor arrangement Grant 7,233,059 - Bott , et al. June 19, 2	2007-06-19
Semiconductor arrangement App 20050012215 - Bott, Nikolaus ; et al.	2005-01-20

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.