MAEKAWA; Takuma
Patent Applications and Registrations
Patent applications and USPTO patent grants for MAEKAWA; Takuma.The latest application filed is for "electroless palladium plating bath".
- MAEKAWA; Takuma - Osaka JP
| Patent | Date |
|---|---|
| Electroless Palladium Plating Bath App 20220033973 - MAEKAWA; Takuma ; et al. | 2022-02-03 |
| Conductive bump and electroless Pt plating bath Grant 11,049,838 - Maekawa , et al. June 29, 2 | 2021-06-29 |
| Electroless plating bath Grant 10,947,623 - Maekawa , et al. March 16, 2 | 2021-03-16 |
| Electroless Plating Bath App 20200173030 - MAEKAWA; Takuma ; et al. | 2020-06-04 |
| CONDUCTIVE BUMP AND ELECTROLESS Pt PLATING BATH App 20200020660 - MAEKAWA; Takuma ; et al. | 2020-01-16 |
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