loadpatents
name:-0.0061500072479248
name:-0.0062448978424072
name:-0.00051307678222656
Maekawa; Shigeki Patent Filings

Maekawa; Shigeki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Maekawa; Shigeki.The latest application filed is for "apparatus for volatile organic compound treatment and method of volatile organic compound treatment".

Company Profile
0.18.14
  • Maekawa; Shigeki - Tokyo JP
  • Maekawa; Shigeki - Amagasaki JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Apparatus for volatile organic compound treatment and method of volatile organic compound treatment
Grant 7,785,406 - Ota , et al. August 31, 2
2010-08-31
Pressure-contact type rectifier with contact friction reducer
Grant 7,534,979 - Ito , et al. May 19, 2
2009-05-19
Apparatus For Volatile Organic Compound Treatment And Method Of Volatile Organic Compound Treatment
App 20080210084 - Ota; Kouji ;   et al.
2008-09-04
Semiconductor device test probe
Grant 7,276,923 - Takemoto , et al. October 2, 2
2007-10-02
Semiconductor device test probe
Grant 7,274,195 - Takemoto , et al. September 25, 2
2007-09-25
Pressure-contact type rectifier
App 20070139979 - Ito; Shinichi ;   et al.
2007-06-21
Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested
Grant 7,112,976 - Tokumo , et al. September 26, 2
2006-09-26
Semiconductor device test probe
App 20060038575 - Takemoto; Megumi ;   et al.
2006-02-23
Socket for testing a semiconductor device and a connecting sheet used for the same
Grant 6,989,681 - Maekawa , et al. January 24, 2
2006-01-24
Semiconductor Device Test Probe Having Improved Tip Portion
App 20050189955 - Takemoto, Megumi ;   et al.
2005-09-01
Socket for testing a semiconductor device and a connecting sheet used for the same
App 20050145842 - Maekawa, Shigeki ;   et al.
2005-07-07
Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter
Grant 6,888,344 - Maekawa , et al. May 3, 2
2005-05-03
Probe card, and testing apparatus having the same
Grant 6,885,204 - Takemoto , et al. April 26, 2
2005-04-26
Vehicle AC generator with rectifier diode package disposed between cooling plates
Grant 6,882,069 - Kashihara , et al. April 19, 2
2005-04-19
Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested
App 20040209491 - Tokumo, Yasushi ;   et al.
2004-10-21
Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested
Grant 6,794,890 - Tokumo , et al. September 21, 2
2004-09-21
Member for removing foreign matter adhering to probe tip and method of manufacturing the probe tip, method of cleaning foreign matter adhering to probe tip, probe, and probing apparatus
Grant 6,741,086 - Maekawa , et al. May 25, 2
2004-05-25
Probe card, and testing apparatus having the same
App 20040046580 - Takemoto, Megumi ;   et al.
2004-03-11
Socket for testing a semiconductor device and a connecting sheet used for the same
App 20040046581 - Maekawa, Shigeki ;   et al.
2004-03-11
Probe card, and testing apparatus having the same
Grant 6,667,626 - Takemoto , et al. December 23, 2
2003-12-23
Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter
Grant 6,646,455 - Maekawa , et al. November 11, 2
2003-11-11
Semiconductor device test probe having improved tip portion and manufacturing method thereof
Grant 6,633,176 - Takemoto , et al. October 14, 2
2003-10-14
Probe card for testing semiconductor integrated circuit and method of manufacturing the same
Grant 6,628,127 - Takemoto , et al. September 30, 2
2003-09-30
Probe card, and testing apparatus having the same
App 20030160624 - Takemoto, Megumi ;   et al.
2003-08-28
Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter
App 20030090280 - Maekawa, Shigeki ;   et al.
2003-05-15
Member for removing foreign matter adhering to probe tip and method of manufacturing the probe tip, method of cleaning foreign matter adhering to probe tip, probe, and probing apparatus
App 20020190737 - Maekawa, Shigeki ;   et al.
2002-12-19
Test Probe For Semiconductor Devices, Method Of Manufacturing Of The Same, And Member For Removing Foreign Matter
App 20020097060 - MAEKAWA, SHIGEKI ;   et al.
2002-07-25
Semiconductor device test probe, manufacturing method therefor and semiconductor device tested by the probe
App 20010046715 - Takemoto, Megumi ;   et al.
2001-11-29
Probe card for testing semiconductor integrated circuit and method of manufacturing the same
App 20010015650 - Takemoto, Megumi ;   et al.
2001-08-23
Metallic material made from tungsten or molybdenum, method of producing the metallic material, and secondary product material using the metallic material
Grant 5,972,069 - Maekawa , et al. October 26, 1
1999-10-26
Method for manufacturing casting and apparatus for manufacturing a casting
Grant 5,433,262 - Kawaguchi , et al. July 18, 1
1995-07-18
Manufacturing method for defect-free casting product
Grant 5,067,550 - Maekawa , et al. November 26, 1
1991-11-26

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