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Apparatus for volatile organic compound treatment and method of volatile organic compound treatment Grant 7,785,406 - Ota , et al. August 31, 2 | 2010-08-31 |
Pressure-contact type rectifier with contact friction reducer Grant 7,534,979 - Ito , et al. May 19, 2 | 2009-05-19 |
Apparatus For Volatile Organic Compound Treatment And Method Of Volatile Organic Compound Treatment App 20080210084 - Ota; Kouji ;   et al. | 2008-09-04 |
Semiconductor device test probe Grant 7,276,923 - Takemoto , et al. October 2, 2 | 2007-10-02 |
Semiconductor device test probe Grant 7,274,195 - Takemoto , et al. September 25, 2 | 2007-09-25 |
Pressure-contact type rectifier App 20070139979 - Ito; Shinichi ;   et al. | 2007-06-21 |
Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested Grant 7,112,976 - Tokumo , et al. September 26, 2 | 2006-09-26 |
Semiconductor device test probe App 20060038575 - Takemoto; Megumi ;   et al. | 2006-02-23 |
Socket for testing a semiconductor device and a connecting sheet used for the same Grant 6,989,681 - Maekawa , et al. January 24, 2 | 2006-01-24 |
Semiconductor Device Test Probe Having Improved Tip Portion App 20050189955 - Takemoto, Megumi ;   et al. | 2005-09-01 |
Socket for testing a semiconductor device and a connecting sheet used for the same App 20050145842 - Maekawa, Shigeki ;   et al. | 2005-07-07 |
Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter Grant 6,888,344 - Maekawa , et al. May 3, 2 | 2005-05-03 |
Probe card, and testing apparatus having the same Grant 6,885,204 - Takemoto , et al. April 26, 2 | 2005-04-26 |
Vehicle AC generator with rectifier diode package disposed between cooling plates Grant 6,882,069 - Kashihara , et al. April 19, 2 | 2005-04-19 |
Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested App 20040209491 - Tokumo, Yasushi ;   et al. | 2004-10-21 |
Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested Grant 6,794,890 - Tokumo , et al. September 21, 2 | 2004-09-21 |
Member for removing foreign matter adhering to probe tip and method of manufacturing the probe tip, method of cleaning foreign matter adhering to probe tip, probe, and probing apparatus Grant 6,741,086 - Maekawa , et al. May 25, 2 | 2004-05-25 |
Probe card, and testing apparatus having the same App 20040046580 - Takemoto, Megumi ;   et al. | 2004-03-11 |
Socket for testing a semiconductor device and a connecting sheet used for the same App 20040046581 - Maekawa, Shigeki ;   et al. | 2004-03-11 |
Probe card, and testing apparatus having the same Grant 6,667,626 - Takemoto , et al. December 23, 2 | 2003-12-23 |
Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter Grant 6,646,455 - Maekawa , et al. November 11, 2 | 2003-11-11 |
Semiconductor device test probe having improved tip portion and manufacturing method thereof Grant 6,633,176 - Takemoto , et al. October 14, 2 | 2003-10-14 |
Probe card for testing semiconductor integrated circuit and method of manufacturing the same Grant 6,628,127 - Takemoto , et al. September 30, 2 | 2003-09-30 |
Probe card, and testing apparatus having the same App 20030160624 - Takemoto, Megumi ;   et al. | 2003-08-28 |
Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter App 20030090280 - Maekawa, Shigeki ;   et al. | 2003-05-15 |
Member for removing foreign matter adhering to probe tip and method of manufacturing the probe tip, method of cleaning foreign matter adhering to probe tip, probe, and probing apparatus App 20020190737 - Maekawa, Shigeki ;   et al. | 2002-12-19 |
Test Probe For Semiconductor Devices, Method Of Manufacturing Of The Same, And Member For Removing Foreign Matter App 20020097060 - MAEKAWA, SHIGEKI ;   et al. | 2002-07-25 |
Semiconductor device test probe, manufacturing method therefor and semiconductor device tested by the probe App 20010046715 - Takemoto, Megumi ;   et al. | 2001-11-29 |
Probe card for testing semiconductor integrated circuit and method of manufacturing the same App 20010015650 - Takemoto, Megumi ;   et al. | 2001-08-23 |
Metallic material made from tungsten or molybdenum, method of producing the metallic material, and secondary product material using the metallic material Grant 5,972,069 - Maekawa , et al. October 26, 1 | 1999-10-26 |
Method for manufacturing casting and apparatus for manufacturing a casting Grant 5,433,262 - Kawaguchi , et al. July 18, 1 | 1995-07-18 |
Manufacturing method for defect-free casting product Grant 5,067,550 - Maekawa , et al. November 26, 1 | 1991-11-26 |