| Patent | Date |
|---|
Semiconductor device with copper interconnections
Grant 11,450,561 - Omori , et al. September 20, 2 | 2022-09-20 |
Semiconductor Device And Method Of Manufacturing The Same
App 20200251385 - Kind Code | 2020-08-06 |
Semiconductor device with an interconnection layer and method of manufacturing the same
Grant 10,665,502 - Omori , et al. | 2020-05-26 |
Semiconductor device
Grant 10,204,853 - Matsumoto , et al. Feb | 2019-02-12 |
Semiconductor device and its manufacturing method
Grant 10,192,755 - Matsumoto , et al. Ja | 2019-01-29 |
Semiconductor device and manufacturing method thereof
Grant 10,083,924 - Maekawa , et al. September 25, 2 | 2018-09-25 |
Semiconductor Device And Method Of Manufacturing The Same
App 20180240700 - OMORI; Kazuyuki ; et al. | 2018-08-23 |
Semiconductor Device And Its Manufacturing Method
App 20180197753 - MATSUMOTO; Masahiro ; et al. | 2018-07-12 |
Method of manufacturing semiconductor device including copper interconnections
Grant 9,972,530 - Omori , et al. May 15, 2 | 2018-05-15 |
Semiconductor device and its manufacturing method
Grant 9,972,505 - Matsumoto , et al. May 15, 2 | 2018-05-15 |
Semiconductor Device
App 20170372996 - MATSUMOTO; Masahiro ; et al. | 2017-12-28 |
Manufacturing method of back illumination CMOS image sensor device using wafer bonding
Grant 9,608,034 - Maekawa March 28, 2 | 2017-03-28 |
Semiconductor device and method of manufacturing the same
Grant 9,607,956 - Matsumoto , et al. March 28, 2 | 2017-03-28 |
Semiconductor Device And Method Of Manufacturing The Same
App 20170040212 - OMORI; Kazuyuki ; et al. | 2017-02-09 |
Semiconductor Device And Manufacturing Method Thereof
App 20160379946 - MAEKAWA; Kazuyoshi ; et al. | 2016-12-29 |
Manufacturing method of semiconductor integrated circuit device
Grant 9,530,819 - Maekawa December 27, 2 | 2016-12-27 |
Semicondutor device with copper plugs having different resistance values
Grant 9,508,646 - Omori , et al. November 29, 2 | 2016-11-29 |
Semiconductor Device And Method Of Manufacturing The Same
App 20160268222 - Matsumoto; Masahiro ; et al. | 2016-09-15 |
Semiconductor device and method of manufacturing the same
Grant 9,406,628 - Matsumoto , et al. August 2, 2 | 2016-08-02 |
Semiconductor Device And Its Manufacturing Method
App 20160181184 - MATSUMOTO; Masahiro ; et al. | 2016-06-23 |
Manufacturing Method Of Back Illumination Cmos Image Sensor Device Using Wafer Bonding
App 20160118437 - MAEKAWA; Kazuyoshi | 2016-04-28 |
Manufacturing method of back illumination CMOS image sensor device using wafer bonding
Grant 9,263,497 - Maekawa February 16, 2 | 2016-02-16 |
Manufacturing Method Of Semiconductor Integrated Circuit Device
App 20160043133 - MAEKAWA; Kazuyoshi | 2016-02-11 |
Semiconductor Device And Method Of Manufacturing The Same
App 20150221597 - Omori; Kazuyuki ; et al. | 2015-08-06 |
Semiconductor Device And Method Of Manufacturing The Same
App 20140284790 - Matsumoto; Masahiro ; et al. | 2014-09-25 |
Semiconductor device with a line and method of fabrication thereof
Grant 8,749,064 - Maekawa , et al. June 10, 2 | 2014-06-10 |
Manufacturing Method Of Semiconductor Device
App 20140141560 - MAEKAWA; Kazuyoshi | 2014-05-22 |
Semiconductor device having a multilevel interconnect structure and method for fabricating the same
Grant 8,709,939 - Koike , et al. April 29, 2 | 2014-04-29 |
Semiconductor Device With A Line And Method Of Fabrication Thereof
App 20130234334 - MAEKAWA; Kazuyoshi ; et al. | 2013-09-12 |
Semiconductor device with a line and method of fabrication thereof
Grant 8,432,037 - Maekawa , et al. April 30, 2 | 2013-04-30 |
Semiconductor Device Having A Multilevel Interconnect Structure And Method For Fabricating The Same
App 20130089979 - KOIKE; Junichi ; et al. | 2013-04-11 |
Semiconductor device having a multilevel interconnect structure and method for fabricating the same
Grant 8,304,908 - Koike , et al. November 6, 2 | 2012-11-06 |
Semiconductor device with a line and method of fabrication thereof
Grant 8,222,146 - Maekawa , et al. July 17, 2 | 2012-07-17 |
Semiconductor Device With A Line And Method Of Fabrication Thereof
App 20120168949 - MAEKAWA; Kazuyoshi ; et al. | 2012-07-05 |
Semiconductor device having wiring with oxide layer of impurity from the wiring
Grant 8,125,085 - Maekawa , et al. February 28, 2 | 2012-02-28 |
Semiconductor Device With A Line And Method Of Fabrication Thereof
App 20110171828 - Maekawa; Kazuyoshi ; et al. | 2011-07-14 |
Semiconductor device with a line and method of fabrication thereof
Grant 7,936,069 - Maekawa , et al. May 3, 2 | 2011-05-03 |
Semiconductor Device With A Line And Method Of Fabrication Thereof
App 20100176511 - Maekawa; Kazuyoshi ; et al. | 2010-07-15 |
Semiconductor device with a line and method of fabrication thereof
Grant 7,709,955 - Maekawa , et al. May 4, 2 | 2010-05-04 |
Semiconductor device with a line and method of fabrication thereof
Grant 7,709,388 - Maekawa , et al. May 4, 2 | 2010-05-04 |
Method Of Manufacturing Semiconductor Device, And Semiconductor Device
App 20100044864 - MAEKAWA; Kazuyoshi ; et al. | 2010-02-25 |
Semiconductor device and method for fabricating the same
App 20090236747 - Koike; Junichi ; et al. | 2009-09-24 |
Semiconductor device and method for fabricating the same
Grant 7,564,133 - Hamada , et al. July 21, 2 | 2009-07-21 |
Semiconductor device and method of manufacturing same
Grant 7,538,030 - Maekawa May 26, 2 | 2009-05-26 |
Semiconductor device and method of manufacturing same
Grant 7,479,446 - Maekawa January 20, 2 | 2009-01-20 |
Semiconductor device having at least two layers of wirings stacked therein and method of manufacturing the same
App 20080197496 - Mori; Kenichi ; et al. | 2008-08-21 |
Method of manufacturing a semiconductor device
Grant 7,371,681 - Maekawa May 13, 2 | 2008-05-13 |
Semiconductor Device And Method Of Manufacturing Same
App 20080076239 - Maekawa; Kazuyoshi | 2008-03-27 |
Semiconductor Device And Method Of Manufacturing Same
App 20080064196 - Maekawa; Kazuyoshi | 2008-03-13 |
Semiconductor device and manufacturing method thereof
App 20070145600 - Yano; Hisashi ; et al. | 2007-06-28 |
Semiconductor device and manufacturing method therof
App 20070145591 - Yano; Hisashi ; et al. | 2007-06-28 |
Semiconductor Device With A Line And Method Of Fabrication Thereof
App 20070141831 - MAEKAWA; Kazuyoshi ; et al. | 2007-06-21 |
Semiconductor Device With A Line And Method Of Fabrication Thereof
App 20070138532 - MAEKAWA; Kazuyoshi ; et al. | 2007-06-21 |
Semiconductor device with a line and method of fabrication thereof
Grant 7,192,871 - Maekawa , et al. March 20, 2 | 2007-03-20 |
Semiconductor device and method for fabricating the same
App 20060223325 - Hamada; Masakazu ; et al. | 2006-10-05 |
Semiconductor device and method of manufacturing same
App 20060054981 - Maekawa; Kazuyoshi | 2006-03-16 |
Semiconductor device with a line and method of fabrication thereof
App 20050275110 - Maekawa, Kazuyoshi ; et al. | 2005-12-15 |
Semiconductor device including a polysilicon, barrier structure, and tungsten layer electrode
Grant 6,975,007 - Maekawa December 13, 2 | 2005-12-13 |
Method for manufacturing a semiconductor device
Grant 6,864,183 - Maekawa March 8, 2 | 2005-03-08 |
Semiconductor device and method for manufacturing same
App 20040113213 - Maekawa, Kazuyoshi | 2004-06-17 |
Contact structure, method of forming the same, semiconductor device, and method of manufacturing the same
Grant 6,657,301 - Maekawa , et al. December 2, 2 | 2003-12-02 |
Method for manufacturing a semiconductor device
App 20030203606 - Maekawa, Kazuyoshi | 2003-10-30 |
Method of producing a semiconductor device
Grant 6,599,820 - Kanda , et al. July 29, 2 | 2003-07-29 |
Contact structure, method of forming the same, semiconductor device, and method of manufacturing the same
App 20030006504 - Maekawa, Kazuyoshi ; et al. | 2003-01-09 |
Manufacturing Process Of A Semiconductor Device
App 20010009804 - MAEKAWA, KAZUYOSHI | 2001-07-26 |
Manufacturing method of semiconductor device having high pressure reflow process
Grant 6,171,957 - Maekawa January 9, 2 | 2001-01-09 |
Semiconductor device comprising composite barrier layer
Grant 5,565,708 - Ohsaki , et al. October 15, 1 | 1996-10-15 |
Multilayer interconnection structure for a semiconductor device
Grant 5,313,100 - Ishii , et al. May 17, 1 | 1994-05-17 |
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