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Method and process using dual memorization layer for multi-color spacer patterning
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Selective Etching with Fluorine, Oxygen and Noble Gas Containing Plasmas
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Method and structure for low density silicon oxide for fusion bonding and debonding
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Etching Method And Etching Apparatus
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Method and Process Using Dual Memorization Layer for Multi-Color Spacer Patterning
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Plasma etching method
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Methods to reduce gouging for core removal processes using thermal decomposition materials
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Methods to reshape spacers for multi-patterning processes using thermal decomposition materials
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Method to transfer patterns to a layer
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Self-aligned interconnect patterning for back-end-of-line (BEOL) structures including self-aligned via through the underlying interlevel metal layer
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Method of patterning low-k materials using thermal decomposition materials
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Platform and method of operating for integrated end-to-end CMP-less interconnect process
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Plasma Etching Method
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Method And Structure for Low Density Silicon Oxide for Fusion Bonding and Debonding
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Semiconductor Back End Of Line (beol) Interconnect Using Multiple Materials In A Fully Self-aligned Via (fsav) Process
App 20200303253 - Aizawa; Hirokazu ; et al. | 2020-09-24 |
Semiconductor back end of line (BEOL) interconnect using multiple materials in a fully self-aligned via (FSAV) process
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Method of integrated circuit fabrication with dual metal power rail
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Method To Transfer Patterns To A Layer
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Methods To Reduce Gouging For Core Removal Processes Using Thermal Decomposition Materials
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Methods To Reshape Spacers For Multi-patterning Processes Using Thermal Decomposition Materials
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Method Utilizing Thermal Decomposition Material To Relax Queue Time Control
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Method of Patterning Low-K Materials Using Thermal Decomposition Materials
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Subtractive Interconnect Formation Using A Fully Self-aligned Scheme
App 20190304836 - Kikuchi; Yuki ; et al. | 2019-10-03 |
Platform And Method Of Operating For Integrated End-to-end Cmp-less Interconnect Process
App 20190295887 - Trickett; Ying ; et al. | 2019-09-26 |
Wrap-around contact integration scheme
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Integration of a self-forming barrier layer and a ruthenium metal liner in copper metallization
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Method Of Integrated Circuit Fabrication With Dual Metal Power Rail
App 20180350665 - Chae; Soo Doo ; et al. | 2018-12-06 |
Method of corner rounding and trimming of nanowires by microwave plasma
Grant 10,008,564 - Tapily , et al. June 26, 2 | 2018-06-26 |
Wrap-around Contact Integration Scheme
App 20180068899 - Tapily; Kandabara N. ; et al. | 2018-03-08 |
Integration Of A Self-forming Barrier Layer And A Ruthenium Metal Liner In Copper Metallization
App 20170236752 - Yu; Kai-Hung L. ; et al. | 2017-08-17 |
Method Of Corner Rounding And Trimming Of Nanowires By Microwave Plasma
App 20170125517 - Tapily; Kandabara N. ; et al. | 2017-05-04 |
Integration of ALD barrier layer and CVD Ru liner for void-free Cu filling
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Method For Forming Manganese-containing Film
App 20160326646 - MATSUMOTO; Kenji ; et al. | 2016-11-10 |
Method for manufacturing semiconductor device for forming metal element-containing layer on insulating layer in which concave portion is formed, semiconductor device including insulating layer in which concave portion is formed, and semiconductor layer on insulating layer in which concave portion is
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INTEGRATION OF ALD BARRIER LAYER AND CVD Ru LINER FOR VOID-FREE Cu FILLING
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Method For Manufacturing Semiconductor Device
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Method For Forming Manganese-containing Film
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Method For Manufacturing Semiconductor Device, Semiconductor Device, And Apparatus For Producing Semiconductor
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Semiconductor Device, Semiconductor Device Manufacturing Method, And Semiconductor Manufacturing Apparatus
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Semiconductor Device Manufacturing Method And Substrate Processing System
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Semiconductor device manufacturing method that recovers damage of the etching target while supplying a predetermined recovery gas
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Manufacturing method for semiconductor device and manufacturing device of semiconductor device
App 20090017621 - Sako; Takuji ; et al. | 2009-01-15 |
Sputtering method and sputtering apparatus
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Substrate Peripheral Film-removing Apparatus And Substrate Peripheral Film-removing Method
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Method For Manufacturing Semiconductor Device, Semiconductor Manufacturing Apparatus And Storage Medium For Executing The Method
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Method And Apparatus For Manufacturing Semiconductor Device, And Storage Medium For Executing The Method
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Manufacturing method for semiconductor device, semiconductor device, substrate processing system, program and memory medium
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Substrate Peripheral Film-removing Apparatus And Substrate Peripheral Film-removing Method
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Semiconductor Device Manufacturing Method And Substrate Processing System
App 20070122752 - ASAKO; Ryuichi ; et al. | 2007-05-31 |
Method for patterning a semiconductor wafer
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Fabrication process of a semiconductor device
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Processing method and apparatus for removing oxide film
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Production method for semiconductor device
App 20040132277 - Maekawa, Kaoru | 2004-07-08 |
Semiconductor device having a low dielectric film and fabrication process thereof
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Processing method and apparatus for removing oxide film
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Fabrication process of a semiconductor device
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Processing method and apparatus for removing oxide film
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Cooking apparatus operated by a single operational key that automatically sets a most suitable cooking mode
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Electronic air cleaner
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