Maekawa; Iwao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Maekawa; Iwao.The latest application filed is for "semiconductor device and process for fabrication thereof".

Company Profile

0.18.10

Maekawa; Iwao - Hitachi JP
Maekawa; Iwao - Ibaraki-ken JP
Maekawa; Iwao - Chiyoda-ku JP
Maekawa; Iwao - Tokyo JP
Maekawa, Iwao - Hitachi-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and process for fabrication thereof Grant 7,781,896 - Takeda , et al. August 24, 2	2010-08-24
Semiconductor Device And Process For Fabrication Thereof App 20080290529 - TAKEDA; Shinji ; et al.	2008-11-27
Semiconductor device and process for fabrication thereof Grant 7,387,914 - Takeda , et al. June 17, 2	2008-06-17
Process for preparing an ink-jet recording material Grant 7,326,440 - Tokunaga , et al. February 5, 2	2008-02-05
Semiconductor Device And Process For Fabrication Thereof App 20060180903 - Takeda; Shinji ; et al.	2006-08-17
Semiconductor device and process for fabrication thereof Grant 7,078,094 - Takeda , et al. July 18, 2	2006-07-18
Semiconductor device and process for fabrication thereof Grant 7,057,265 - Takeda , et al. June 6, 2	2006-06-06
Semiconductor device and process for fabrication thereof Grant 7,012,320 - Takeda , et al. March 14, 2	2006-03-14
Ink-jet recording material for proof Grant 6,991,330 - Maekawa January 31, 2	2006-01-31
Semiconductor device and process for fabrication thereof Grant 6,855,579 - Takeda , et al. February 15, 2	2005-02-15
Semiconductor device and process for fabrication thereof App 20040253770 - Takeda, Shinji ; et al.	2004-12-16
Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device Grant 6,825,249 - Takeda , et al. November 30, 2	2004-11-30
Process for preparing an ink-jet recording material App 20040086665 - Tokunaga, Yukio ; et al.	2004-05-06
Semiconductor device and process for fabrication thereof Grant 6,717,242 - Takeda , et al. April 6, 2	2004-04-06
Ink-jet recording material for proof App 20030203133 - Maekawa, Iwao	2003-10-30
Semiconductor device and process for fabrication thereof App 20030160337 - Takeda, Shinji ; et al.	2003-08-28
Sheet-state ink-jet recording material App 20030054145 - Tokunaga, Yukio ; et al.	2003-03-20
Semiconductor device and process for fabrication thereof App 20010035533 - Takeda, Shinji ; et al.	2001-11-01
Semiconductor device and process for fabrication thereof App 20010016384 - Takeda, Shinji ; et al.	2001-08-23
Semiconductor device and process for fabrication thereof App 20010009780 - Takeda, Shinji ; et al.	2001-07-26
Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device Grant 6,099,678 - Kotato , et al. August 8, 2	2000-08-08
Electroconductive resin paste Grant 4,732,702 - Yamazaki , et al. March 22, 1	1988-03-22
Moistureproof insulating coating composition for packing circuit boards Grant 4,490,496 - Maekawa , et al. December 25, 1	1984-12-25
Process for producing polyimide-amide-carboxylic acid Grant 4,338,427 - Maekawa , et al. July 6, 1	1982-07-06
Resin composition with low shrinkage Grant 4,233,413 - Monma , et al. November 11, 1	1980-11-11
Resin composition having low shrink properties Grant 4,228,251 - Maekawa , et al. October 14, 1	1980-10-14
Resinous composition Grant 4,224,430 - Maekawa , et al. September 23, 1	1980-09-23
Resinous composition Grant 4,100,120 - Maekawa , et al. July 11, 1	1978-07-11

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