MAEJIMA; Kenzou

Patent Applications and Registrations

Patent applications and USPTO patent grants for MAEJIMA; Kenzou.The latest application filed is for "method for manufacturing electronic component, and electronic component".

Company Profile

0.6.8

MAEJIMA; Kenzou - Tokyo JP
Maejima; Kenzou - Shinagawa-ku JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Manufacturing Electronic Component, And Electronic Component App 20130324641 - MAEJIMA; Kenzou ; et al.	2013-12-05
Adhesive film Grant 8,597,785 - Komiyatani , et al. December 3, 2	2013-12-03
Method for manufacturing electronic component, and electronic component Grant 8,531,028 - Maejima , et al. September 10, 2	2013-09-10
Method of manufacturing electronic device and electronic device Grant 8,389,328 - Meura , et al. March 5, 2	2013-03-05
Method Of Manufacturing Electronic Device, Electronic Device, And Apparatus For Manufacturing Electronic Device App 20120199988 - Meura; Toru ; et al.	2012-08-09
Adhesive Film, Multilayer Circuit Board, Electronic Component And Semiconductor Device App 20120156502 - Maejima; Kenzou ; et al.	2012-06-21
Process And Apparatus For Manufacturing Semiconductor Device App 20120118939 - KUSANAGI; Keiyo ; et al.	2012-05-17
Method For Manufacturing Electronic Component, And Electronic Component App 20120061820 - Maejima; Kenzou ; et al.	2012-03-15
Flexible Substrate And Electronic Device App 20110262697 - Katsurayama; Satoru ; et al.	2011-10-27
Method Of Manufacturing Electronic Device And Electronic Device App 20110221075 - Meura; Toru ; et al.	2011-09-15
Adhesive Tape App 20100203307 - Komiyatani; Toshio ; et al.	2010-08-12

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