Maejima; Hisashi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Maejima; Hisashi.The latest application filed is for "shoe upper".
- Maejima; Hisashi - Kanagawa JP
- Maejima; Hisashi - Tokyo JP
- Maejima; Hisashi - Higashiyamato JP
| Patent | Date |
|---|---|
| Shoe upper Grant D574,590 - Maejima August 12, 2 | 2008-08-12 |
| Wafer having chamfered bend portions in the joint regions between the contour of the cut-away portion of the wafer Grant RE40,139 - Maejima , et al. March 4, 2 | 2008-03-04 |
| Semiconductor integrated circuit device fabrication method and its fabrication apparatus Grant 5,497,331 - Iriki , et al. March 5, 1 | 1996-03-05 |
| Wafer having chamfered bend portions in the joint regions between the contour of the wafer and the cut-away portion of the wafer Grant 5,230,747 - Maejima , et al. July 27, 1 | 1993-07-27 |
| Exposure method and exposure apparatus Grant 5,025,284 - Komoriya , et al. June 18, 1 | 1991-06-18 |
| Exposure method and exposure apparatus Grant 4,974,018 - Komoriya , et al. * November 27, 1 | 1990-11-27 |
| Wafer and method of working the same Grant 4,783,225 - Maejima , et al. November 8, 1 | 1988-11-08 |
| Manufacturing system Grant 4,544,318 - Nagatomo , et al. October 1, 1 | 1985-10-01 |
| Method of and apparatus for aligning photomask Grant 4,218,136 - Komoriya , et al. August 19, 1 | 1980-08-19 |
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