Maehara; Yasutomo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Maehara; Yasutomo.The latest application filed is for "printed circuit board incorporating fibers".
- Maehara; Yasutomo - Kawasaki N/A JP
| Patent | Date |
|---|---|
| Printed circuit board incorporating fibers Grant 8,754,333 - Yoshimura , et al. June 17, 2 | 2014-06-17 |
| Method of producing substrate Grant 8,186,052 - Iida , et al. May 29, 2 | 2012-05-29 |
| Printed Circuit Board Incorporating Fibers App 20120097442 - YOSHIMURA; Hideaki ; et al. | 2012-04-26 |
| Method of producing substrate Grant 8,151,456 - Maehara , et al. April 10, 2 | 2012-04-10 |
| Circuit board and method of producing the same Grant 8,153,908 - Iida , et al. April 10, 2 | 2012-04-10 |
| Core substrate and printed wiring board Grant 8,119,925 - Yoshimura , et al. February 21, 2 | 2012-02-21 |
| Circuit board Grant 8,119,923 - Yoshimura , et al. February 21, 2 | 2012-02-21 |
| Printed wiring board Grant 8,110,749 - Yoshimura , et al. February 7, 2 | 2012-02-07 |
| Printed Wiring Board, Method For Manufacturing The Same, And Electronic Equipment App 20120024586 - YOSHIMURA; Hideaki ; et al. | 2012-02-02 |
| Core substrate and method of producing the same Grant 8,035,037 - Iida , et al. October 11, 2 | 2011-10-11 |
| Process for producing multilayer board Grant 7,943,001 - Nakagawa , et al. May 17, 2 | 2011-05-17 |
| Core Substrate And Printed Wiring Board App 20090294161 - YOSHIMURA; Hideaki ; et al. | 2009-12-03 |
| Printed Wiring Board App 20090294166 - YOSHIMURA; Hideaki ; et al. | 2009-12-03 |
| Circuit Board And Method Of Producing The Same App 20090095511 - IIDA; Kenji ; et al. | 2009-04-16 |
| Method Of Producing Substrate App 20090094824 - Iida; Kenji ; et al. | 2009-04-16 |
| Core Substrate And Method Of Producing The Same App 20090095524 - Iida; Kenji ; et al. | 2009-04-16 |
| Method Of Producing Substrate App 20090094825 - MAEHARA; Yasutomo ; et al. | 2009-04-16 |
| Core Substrate And Method Of Producing The Same App 20090095509 - Hirano; Shin ; et al. | 2009-04-16 |
| Core Member And Method Of Producing The Same App 20090098391 - NAKAGAWA; Takashi ; et al. | 2009-04-16 |
| Circuit Board App 20090084590 - YOSHIMURA; Hideaki ; et al. | 2009-04-02 |
| Process for producing multilayer board App 20070289706 - Nakagawa; Takashi ; et al. | 2007-12-20 |
| Printed board unit for optical transmission and mounting method Grant 6,959,125 - Kanda , et al. October 25, 2 | 2005-10-25 |
| Multi-layer wiring board and method of producing same Grant 6,812,412 - Obata , et al. November 2, 2 | 2004-11-02 |
| Printed board unit for optical transmission and mounting method App 20030228084 - Kanda, Takashi ; et al. | 2003-12-11 |
| Multi-layer wiring board and method of producing same App 20030098179 - Obata, Souichi ; et al. | 2003-05-29 |
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