Maegawa; Kiyotaka
Patent Applications and Registrations
Patent applications and USPTO patent grants for Maegawa; Kiyotaka.The latest application filed is for "ceramic electronic component and method of manufacturing the same".
- Maegawa; Kiyotaka - Nagaokakyo JP
- MAEGAWA; Kiyotaka - Nagaokakyo-shi JP
- Maegawa; Kiyotaka - Hikone JP
- Maegawa; Kiyotaka - Hikone-shi JP
| Patent | Date |
|---|---|
| Method of manufacturing a ceramic electronic component Grant 10,283,273 - Hamanaka , et al. | 2019-05-07 |
| Ceramic electronic component and method of manufacturing the same Grant 9,799,452 - Hamanaka , et al. October 24, 2 | 2017-10-24 |
| Ceramic electronic component and method of manufacturing the same Grant 9,672,963 - Hamanaka , et al. June 6, 2 | 2017-06-06 |
| Ceramic Electronic Component And Method Of Manufacturing The Same App 20170140874 - HAMANAKA; Kenichi ; et al. | 2017-05-18 |
| Ceramic electronic component and method of manufacturing the same Grant 9,595,375 - Hamanaka , et al. March 14, 2 | 2017-03-14 |
| Monolithic ceramic electronic component and method for manufacturing the same Grant 7,612,983 - Maegawa , et al. November 3, 2 | 2009-11-03 |
| Lead-free solder and soldered article Grant 7,488,445 - Takaoka , et al. February 10, 2 | 2009-02-10 |
| Lead-free solder and soldered article Grant 7,422,721 - Takaoka , et al. September 9, 2 | 2008-09-09 |
| Lead-free solder and soldered article App 20080070059 - Takaoka; Hidekiyo ; et al. | 2008-03-20 |
| Monolithic Ceramic Electronic Component And Method For Manufacturing The Same App 20070297119 - Maegawa; Kiyotaka ; et al. | 2007-12-27 |
| Lead-free solder and soldered article App 20060285994 - Takaoka; Hidekiyo ; et al. | 2006-12-21 |
| Lead-free solder and soldered article Grant 7,022,282 - Takaoka , et al. April 4, 2 | 2006-04-04 |
| Lead free solder and soldered article Grant 6,660,226 - Takaoka , et al. December 9, 2 | 2003-12-09 |
| Lead-free solder and soldered article App 20020192106 - Takaoka, Hidekiyo ; et al. | 2002-12-19 |
| Lead-free solder and soldered article App 20020131887 - Takaoka, Hidekiyo ; et al. | 2002-09-19 |
| Lead-free solder and soldered article App 20020127136 - Takaoka, Hidekiyo ; et al. | 2002-09-12 |
| Conductive paste and ceramic electronic component App 20020006023 - Maegawa, Kiyotaka ; et al. | 2002-01-17 |
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