Maeda; Takamichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Maeda; Takamichi.The latest application filed is for "solid state imaging device having a solid state image sensor and its peripheral ic mounted on one package".
- Maeda; Takamichi - Ikoma JP
- Maeda; Takamichi - Nara JP
- Maeda; Takamichi - Yamato-Koriyama JP
- Maeda; Takamichi - Yamatokoriyama JP
| Patent | Date |
|---|---|
| Solid state imaging device having a solid state image sensor and its peripheral IC mounted on one package Grant 5,523,608 - Kitaoka , et al. June 4, 1 | 1996-06-04 |
| Method of making tape carrier semiconductor device Grant 5,336,650 - Chikawa , et al. August 9, 1 | 1994-08-09 |
| Method of manufacturing a bump electrode Grant 5,310,699 - Chikawa , et al. May 10, 1 | 1994-05-10 |
| Method of spraying release agent Grant 5,219,608 - Aoki , et al. June 15, 1 | 1993-06-15 |
| Wire bonding method Grant 4,993,618 - Toyozawa , et al. February 19, 1 | 1991-02-19 |
| Plastic encapsulant for semiconductor Grant 4,926,239 - Fujita , et al. May 15, 1 | 1990-05-15 |
| Method of making a through-hole connector Grant 4,383,363 - Hayakawa , et al. May 17, 1 | 1983-05-17 |
| Flat shaped semiconductor encapsulation Grant 4,300,153 - Hayakawa , et al. November 10, 1 | 1981-11-10 |
| Multi-lead frame member with means for limiting mold spread Grant 4,280,132 - Hayakawa , et al. July 21, 1 | 1981-07-21 |
| Ceramic plate for supporting a semiconductor wafer Grant 4,247,590 - Hayakawa , et al. January 27, 1 | 1981-01-27 |
| Lead electrode structure for a semiconductor chip carried on a flexible carrier Grant 4,151,543 - Hayakawa , et al. April 24, 1 | 1979-04-24 |
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