Maeda; Seiichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Maeda; Seiichi.The latest application filed is for "specular machining apparatus for peripheral edge portion of wafer".
- Maeda; Seiichi - Ayase JP
| Patent | Date |
|---|---|
| Specular machining apparatus for peripheral edge portion of wafer Grant 5,097,630 - Maeda , et al. March 24, 1 | 1992-03-24 |
| Edge polisher Grant 5,094,037 - Hakomori , et al. March 10, 1 | 1992-03-10 |
| Flat lapping machine Grant 4,805,348 - Arai , et al. February 21, 1 | 1989-02-21 |
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