Maeda; Hajime
Patent Applications and Registrations
Patent applications and USPTO patent grants for Maeda; Hajime.The latest application filed is for "clip-type lead frame for electrically connecting two substrates or devices".
- Maeda; Hajime - Wako JP
- Maeda; Hajime - Tokyo JP
- Maeda; Hajime - Hyogo JP
- Maeda, Hajime - Wako City JP
- Maeda; Hajime - Itami JP
- Maeda; Hajime - Yokohama JA
| Patent | Date |
|---|---|
| Blade tensioner and system for a chain Grant 6,808,467 - Takeda , et al. October 26, 2 | 2004-10-26 |
| Clip-type lead frame for electrically connecting two substrates or devices Grant 6,688,892 - Fukumoto , et al. February 10, 2 | 2004-02-10 |
| Semiconductor module and electronic component Grant 6,670,701 - Matsuura , et al. December 30, 2 | 2003-12-30 |
| Tensioner device Grant 6,620,067 - Nakamura , et al. September 16, 2 | 2003-09-16 |
| Clip-type lead frame for electrically connecting two substrates or devices App 20030119340 - Fukumoto, Takakazu ; et al. | 2003-06-26 |
| Blade tensioner and system for a chain App 20020198073 - Takeda, Hiroyuki ; et al. | 2002-12-26 |
| Semiconductor module and electronic component App 20020100965 - Matsuura, Tetsuya ; et al. | 2002-08-01 |
| Substrate mounting an integrated circuit pakage with a deformed lead App 20020008313 - Maeda, Hajime ; et al. | 2002-01-24 |
| IC card having adhesion-preventing sheets Grant 5,327,010 - Uenaka , et al. July 5, 1 | 1994-07-05 |
| IC card and method of manufacturing the IC card Grant 5,313,364 - Omori , et al. May 17, 1 | 1994-05-17 |
| Packaged semiconductor device assembly including two interconnected packaged semiconductor devices mounted on a common substrate Grant 5,309,020 - Murasawa , et al. * May 3, 1 | 1994-05-03 |
| IC card Grant 5,299,940 - Uenaka , et al. April 5, 1 | 1994-04-05 |
| Battery terminal mounting means for a portable electrical device Grant 5,299,955 - Maeda , et al. April 5, 1 | 1994-04-05 |
| IC card connector supporting/fixing mechanism Grant 5,288,237 - Mizutani , et al. February 22, 1 | 1994-02-22 |
| Semiconductor device card and method of manufacturing the same Grant 5,173,841 - Uenaka , et al. December 22, 1 | 1992-12-22 |
| IC card with shutter having L-shaped flanges enclosing the sides of an electrode terminal board Grant 5,047,894 - Onoda , et al. September 10, 1 | 1991-09-10 |
| Voltage-controlled type semiconductor switching device Grant 4,636,824 - Ikoma , et al. January 13, 1 | 1987-01-13 |
| Rotary kiln Grant 4,014,643 - Musha , et al. March 29, 1 | 1977-03-29 |
| Semiconductor Device Grant 3,634,737 - Maeda , et al. January 11, 1 | 1972-01-11 |
| Semiconductor Device Grant 3,612,960 - Takeishi , et al. October 12, 1 | 1971-10-12 |
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