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Patent applications and USPTO patent grants for Mae; Ryota.The latest application filed is for "polishing composition, polishing method and method for producing semiconductor substrate".
Patent | Date |
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Polishing Composition, Polishing Method And Method For Producing Semiconductor Substrate App 20220306900 - Mae; Ryota | 2022-09-29 |
Polishing Composition, Polishing Method And Method For Producing Semiconductor Substrate App 20220306901 - Mae; Ryota | 2022-09-29 |
Method Of Producing Anionically Modified Colloidal Silica App 20210380419 - MAE; Ryota | 2021-12-09 |
Polishing Composition, Polishing Method, And Method Of Producing Semiconductor Substrate App 20210292599 - MAE; Ryota | 2021-09-23 |
Polishing Composition, Method For Producing Polishing Composition, Polishing Method, And Method For Producing Semiconductor Substrate App 20210079264 - MAE; Ryota ;   et al. | 2021-03-18 |
Polishing Composition App 20200308449 - MAE; Ryota ;   et al. | 2020-10-01 |
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