MacNamara; Cormac

Patent Applications and Registrations

Patent applications and USPTO patent grants for MacNamara; Cormac.The latest application filed is for "technique for stable processing of thin/fragile substrates".

Company Profile

0.22.26

MacNamara; Cormac - Belfast GB

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Positive-intrinsic-negative (PIN)/negative-intrinsic-positive (NIP) diode Grant 8,169,057 - Wilson , et al. May 1, 2	2012-05-01
Technique for stable processing of thin/fragile substrates Grant 8,148,203 - Wilson , et al. April 3, 2	2012-04-03
Front lit PIN/NIP diode having a continuous anode/cathode Grant 8,058,091 - Wilson , et al. November 15, 2	2011-11-15
Technique For Stable Processing Of Thin/fragile Substrates App 20110266659 - Wilson; Robin ; et al.	2011-11-03
Technique for stable processing of thin/fragile substrates Grant 7,999,348 - Wilson , et al. August 16, 2	2011-08-16
Photodetector array using isolation diffusions as crosstalk inhibitors between adjacent photodiodes Grant 7,972,934 - Wilson , et al. July 5, 2	2011-07-05
Method of manufacturing a photodiode array with through-wafer vias Grant 7,910,479 - Wilson , et al. March 22, 2	2011-03-22
Direct Wafer-bonded Through-hole Photodiode App 20110042576 - WILSON; Robin ; et al.	2011-02-24
Photodetector array using isolation diffusions as crosstalk inhibitors between adjacent photodiodes Grant 7,821,089 - Wilson , et al. October 26, 2	2010-10-26
Photodetector array using isolation diffusions as crosstalk inhibitors between adjacent photodiodes Grant 7,768,085 - Wilson , et al. August 3, 2	2010-08-03
Photodiode having increased proportion of light-sensitive area to light-insensitive area Grant 7,741,141 - Wilson , et al. June 22, 2	2010-06-22
Positive-intrinsic-negative (PIN)/negative-intrinsic-positive (NIP) diode Grant 7,741,172 - Wilson , et al. June 22, 2	2010-06-22
Silicon wafer having through-wafer vias Grant 7,709,950 - MacNamara , et al. May 4, 2	2010-05-04
Front side electrical contact for photodetector array and method of making same Grant 7,601,556 - Wilson , et al. October 13, 2	2009-10-13
Silicon Wafer Having Through-Wafer Vias With A Predetermined Geometric Shape App 20090253261 - MACNAMARA; Cormac ; et al.	2009-10-08
Method of Manufacturing a Photodiode Array with Through-Wafer Vias App 20090224352 - Wilson; Robin ; et al.	2009-09-10
Method of manufacturing a photodiode array with through-wafer vias Grant 7,579,273 - Wilson , et al. August 25, 2	2009-08-25
Bonded-wafer superjunction semiconductor device Grant 7,579,667 - Brogan , et al. August 25, 2	2009-08-25
Backlit photodiode and method of manufacturing a backlit photodiode Grant 7,576,404 - Wilson , et al. August 18, 2	2009-08-18
Front lit PIN/NIP diode having a continuous anode/cathode Grant 7,560,791 - Wilson , et al. July 14, 2	2009-07-14
Photodiode Having Increased Proportion of Light-Sensitive Area to Light-Insensitive Area App 20090176330 - Wilson; Robin ; et al.	2009-07-09
Silicon wafer having through-wafer vias Grant 7,553,764 - MacNamara , et al. June 30, 2	2009-06-30
Photodiode having increased proportion of light-sensitive area to light-insensitive area Grant 7,528,458 - Wilson , et al. May 5, 2	2009-05-05
Front side electrical contact for photodetector array and method of making same Grant 7,489,014 - Wilson , et al. February 10, 2	2009-02-10
Bonded-wafer Superjunction Semiconductor Device App 20080315247 - Brogan; Conor ; et al.	2008-12-25
Silicon Wafer Having Through-Wafer Vias App 20080315368 - MacNamara; Cormac ; et al.	2008-12-25
Photodetector Array Using Isolation Diffusions As Crosstalk Inhibitors Between Adjacent Photodiodes App 20080315269 - Wilson; Robin ; et al.	2008-12-25
Technique for Stable Processing of Thin/Fragile Substrates App 20080315345 - Wilson; Robin ; et al.	2008-12-25
Front Lip PIN/NIP Diode Having a Continuous Anode/Cathode App 20080299698 - Wilson; Robin ; et al.	2008-12-04
Bonded-wafer superjunction semiconductor device Grant 7,446,018 - Brogan , et al. November 4, 2	2008-11-04
Technique for stable processing of thin/fragile substrates Grant 7,439,178 - Wilson , et al. October 21, 2	2008-10-21
Positive-intrinsic-negative (pin)/negative-intrinsic-positive (nip) Diode App 20080246122 - Wilson; Robin ; et al.	2008-10-09
Front Side Electrical Contact For Photodetector Array And Method Of Making Same App 20080248608 - Wilson; Robin ; et al.	2008-10-09
Photodetector Array Using Isolation Diffusions As Crosstalk Inhibitors Between Adjacent Photodiodes App 20080248606 - Wilson; Robin ; et al.	2008-10-09
Technique for stable processing of thin/fragile substrates Grant 7,429,772 - Wilson , et al. September 30, 2	2008-09-30
Varying Pitch Adapter and a Method of Forming a Varying Pitch Adapter App 20080122040 - Brogan; Conor ; et al.	2008-05-29
Method Of Manufacturing A Photodiode Array With Through-wafer Vias App 20080099870 - Wilson; Robin ; et al.	2008-05-01
Silicon Wafer Having Through-Wafer Vias With A Predetermined Geometric Shape App 20080099924 - MacNamara; Cormac ; et al.	2008-05-01
Technique for Stable Processing of Thin/Fragile Substrates App 20070262378 - Wilson; Robin ; et al.	2007-11-15
Technique for Stable Processing of Thin/Fragile Substrates App 20070254457 - Wilson; Robin ; et al.	2007-11-01
Front Side Electrical Contact For Photodetector Array And Method Of Making Same App 20070215968 - Wilson; Robin ; et al.	2007-09-20
Photodiode Having Increased Proportion Of Light-sensitive Area To Light-insensitive Area App 20070205478 - Wilson; Robin ; et al.	2007-09-06
Backlit Photodiode and Method of Manufacturing a Backlit Photodiode App 20070138588 - Wilson; Robin ; et al.	2007-06-21
Front Lit PIN/NIP Diode Having a Continuous Anode/Cathode App 20070111356 - Wilson; Robin ; et al.	2007-05-17
Photodetector array using isolation diffusions as crosstalk inhibitors between adjacent photodiodes App 20070085117 - Wilson; Robin ; et al.	2007-04-19
Positive-Intrinsic-Negative (PIN) / Negative-Intrinsic-Positive (NIP) Diode App 20070077725 - Wilson; Robin ; et al.	2007-04-05
Bonded-wafer Superjunction Semiconductor Device App 20070063217 - Brogan; Conor ; et al.	2007-03-22
Silicon Wafer Having Through-Wafer Vias App 20060275946 - MacNamara; Cormac ; et al.	2006-12-07

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