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name:-0.0056149959564209
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Maciejewski; Edward Patent Filings

Maciejewski; Edward

Patent Applications and Registrations

Patent applications and USPTO patent grants for Maciejewski; Edward.The latest application filed is for "test structure leveraging the lowest metallization level of an interconnect structure".

Company Profile
4.3.3
  • Maciejewski; Edward - Waterford NY
  • Maciejewski; Edward - Wappingers Falls NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Test structures connected with the lowest metallization levels in an interconnect structure
Grant 10,796,973 - Yang , et al. October 6, 2
2020-10-06
Test structure leveraging the lowest metallization level of an interconnect structure
Grant 10,790,204 - Yang , et al. September 29, 2
2020-09-29
Test Structure Leveraging The Lowest Metallization Level Of An Interconnect Structure
App 20200152530 - Yang; Mankyu ;   et al.
2020-05-14
Test Structures Connected With The Lowest Metallization Levels In An Interconnect Structure
App 20200152531 - Yang; Mankyu ;   et al.
2020-05-14
Fuse structure with thermal and crack-stop protection
Grant 6,653,710 - Adkisson , et al. November 25, 2
2003-11-25
Fuse structure with thermal and crack-stop protection
App 20020113291 - Adkisson, James W. ;   et al.
2002-08-22

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