loadpatents
Patent applications and USPTO patent grants for MACHIDA; Hideaki.The latest application filed is for "polyimide fiber paper using non-thermoplastic polymer".
Patent | Date |
---|---|
Polyimide Fiber Paper Using Non-thermoplastic Polymer App 20220186440 - MACHIDA; Hideaki ;   et al. | 2022-06-16 |
Method For Producing Amidinate Metal Complex App 20220127292 - MACHIDA; Hideaki ;   et al. | 2022-04-28 |
Polyimide fiber sheet Grant 11,230,810 - Machida , et al. January 25, 2 | 2022-01-25 |
Compound App 20200331944 - MACHIDA; Hideaki ;   et al. | 2020-10-22 |
Polyimide Fiber Sheet App 20200115852 - MACHIDA; Hideaki ;   et al. | 2020-04-16 |
Semiconductor device and wiring board design method Grant 10,347,573 - Machida July 9, 2 | 2019-07-09 |
Semiconductor Device And Wiring Board Design Method App 20180108603 - MACHIDA; HIDEAKI | 2018-04-19 |
Method For Forming Copper-based Film And Material For Forming Copper-based Film App 20150211100 - Machida; Hideaki ;   et al. | 2015-07-30 |
Coverlay For High-frequency Circuit Substrate App 20140295189 - HIDAKA; SHOTARO ;   et al. | 2014-10-02 |
Cobalt Base Film-forming Method, Cobalt Base Film-forming Material, And Novel Compound App 20140248427 - Machida; Hideaki ;   et al. | 2014-09-04 |
Film-Deposition Apparatus and Film-Deposition Method App 20090191338 - Matsumoto; Kenji ;   et al. | 2009-07-30 |
Film Forming Material And Method Of Film Forming App 20090130326 - Machida; Hideaki ;   et al. | 2009-05-21 |
Film forming method Grant 7,312,140 - Machida , et al. December 25, 2 | 2007-12-25 |
Film forming material, film forming method, and silicide film Grant 7,045,457 - Machida , et al. May 16, 2 | 2006-05-16 |
Underlayer film for copper, and a semiconductor device including the underlayer film Grant 7,022,606 - Mikami , et al. April 4, 2 | 2006-04-04 |
Film forming method App 20060068103 - Machida; Hideaki ;   et al. | 2006-03-30 |
Film forming method App 20060068100 - Machida; Hideaki ;   et al. | 2006-03-30 |
Film forming method App 20060067230 - Machida; Hideaki ;   et al. | 2006-03-30 |
Film forming method App 20060068101 - Machida; Hideaki ;   et al. | 2006-03-30 |
Film forming method App 20060029734 - Machida; Hideaki ;   et al. | 2006-02-09 |
Film forming method App 20060030161 - Machida; Hideaki ;   et al. | 2006-02-09 |
Method of manufacturing organic polysilane App 20050222359 - Machida, Hideaki ;   et al. | 2005-10-06 |
Film forming material, film forming method, and silicide film App 20050059243 - Machida, Hideaki ;   et al. | 2005-03-17 |
Film forming material, film forming method, and film App 20050048799 - Machida, Hideaki ;   et al. | 2005-03-03 |
Material for forming copper undercoat films App 20040265600 - Machida, Hideaki | 2004-12-30 |
Method and device for producing open type polymide moldings, and base material for reflective bodies in lighting equipment Grant 6,835,348 - Hirosue , et al. December 28, 2 | 2004-12-28 |
Chemical vapor deposition method and related material Grant 6,773,750 - Funakubo , et al. August 10, 2 | 2004-08-10 |
Underlayer film-forming material for copper, method for a forming underlayer film for copper, an underlayer film for copper, and a semiconductor device App 20040137726 - Mikami, Noboru ;   et al. | 2004-07-15 |
Chemical vapor deposition method and related material App 20030205168 - Funakubo, Hiroshi ;   et al. | 2003-11-06 |
Chemical vapor deposition method and related material App 20030203112 - Funakubo, Hiroshi ;   et al. | 2003-10-30 |
Lighting reflection apparatus App 20030090773 - Tanno, Toshihiro ;   et al. | 2003-05-15 |
Method and device for producing open tyre polymide moldings, and base material for reflective bodies in lighting equipment App 20020160214 - Hirosue, Haruhiko ;   et al. | 2002-10-31 |
Chemical vapor deposition method and related material App 20020055001 - Funakubo, Hiroshi ;   et al. | 2002-05-09 |
Optical sensor and sensing method Grant 6,278,106 - Muto , et al. August 21, 2 | 2001-08-21 |
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