Macheiner; Stefan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Macheiner; Stefan.The latest application filed is for "lead frame-based semiconductor package".
- Macheiner; Stefan - Kissing DE
| Patent | Date |
|---|---|
| Leadframe leads having fully plated end faces Grant 11,342,252 - Macheiner , et al. May 24, 2 | 2022-05-24 |
| Lead Frame-based Semiconductor Package App 20220068773 - Scharf; Thorsten ; et al. | 2022-03-03 |
| Chip to Chip Interconnect in Encapsulant of Molded Semiconductor Package App 20210391298 - Saw; Khay Chwan ; et al. | 2021-12-16 |
| Molded Semiconductor Package Having A Negative Standoff App 20210358836 - Stoek; Thomas ; et al. | 2021-11-18 |
| Semiconductor package with top or bottom side cooling and method for manufacturing the semiconductor package Grant 11,145,578 - Macheiner October 12, 2 | 2021-10-12 |
| Chip to chip interconnect in encapsulant of molded semiconductor package Grant 11,133,281 - Saw , et al. September 28, 2 | 2021-09-28 |
| Semiconductor package having leads with a negative standoff Grant 11,101,201 - Stoek , et al. August 24, 2 | 2021-08-24 |
| Semiconductor Package with Top or Bottom Side Cooling App 20210090979 - Macheiner; Stefan | 2021-03-25 |
| Leadframe Leads Having Fully Plated End Faces App 20210020553 - Macheiner; Stefan ; et al. | 2021-01-21 |
| Chip to Chip Interconnect in Encapsulant of Molded Semiconductor Package App 20200321276 - Saw; Khay Chwan ; et al. | 2020-10-08 |
| Leadframe leads having fully plated end faces Grant 10,796,986 - Macheiner , et al. October 6, 2 | 2020-10-06 |
| Semiconductor package having a filled conductive cavity Grant 10,770,399 - Ng , et al. Sep | 2020-09-08 |
| Semiconductor Package Having Leads with a Negative Standoff App 20200279795 - Stoek; Thomas ; et al. | 2020-09-03 |
| Semiconductor Package Having a Filled Conductive Cavity App 20200258842 - A1 | 2020-08-13 |
| Molded Semiconductor Package with C-Wing and Gull-Wing Leads App 20190139869 - Danny Koh; Cher Hau ; et al. | 2019-05-09 |
| Semiconductor package for multiphase circuitry device Grant 10,147,703 - Macheiner , et al. De | 2018-12-04 |
| Enhanced solder pad Grant 10,121,753 - Oetjen , et al. November 6, 2 | 2018-11-06 |
| Semiconductor Package For Multiphase Circuitry Device App 20180277513 - Macheiner; Stefan ; et al. | 2018-09-27 |
| Enhanced Solder Pad App 20180012854 - Oetjen; Jens ; et al. | 2018-01-11 |
| Leadframe Leads Having Fully Plated End Faces App 20170271246 - Macheiner; Stefan ; et al. | 2017-09-21 |
| Multi-chip Semiconductor Power Package App 20170213783 - Meiser; Andreas ; et al. | 2017-07-27 |
| Overmolded substrate-chip arrangement with heat sink Grant 9,385,059 - Ossimitz , et al. July 5, 2 | 2016-07-05 |
| Semiconductor arrangement Grant 9,087,829 - Macheiner , et al. July 21, 2 | 2015-07-21 |
| Overmolded substrate-chip arrangement with heat sink App 20150062825 - Ossimitz; Peter ; et al. | 2015-03-05 |
| Die package Grant 8,704,269 - Macheiner , et al. April 22, 2 | 2014-04-22 |
| Semiconductor Arrangement App 20130032855 - Macheiner; Stefan ; et al. | 2013-02-07 |
| Die Package App 20120161128 - Macheiner; Stefan ; et al. | 2012-06-28 |
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