Ma; Zhaohui

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ma; Zhaohui.The latest application filed is for "thermocompression bond tips and related apparatus and methods".

Company Profile

6.16.21

Ma; Zhaohui - Boise ID
Ma; Zhaohui - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thermocompression Bond Tips And Related Apparatus And Methods App 20210233887 - McClain; Benjamin L. ; et al.	2021-07-29
Method for Solder Bridging Elimination for Bulk Solder C2S Interconnects App 20210183802 - WIRZ; BRANDON P. ; et al.	2021-06-17
Bond Pad With Micro-protrusions For Direct Metallic Bonding App 20210175194 - Yu; Aibin ; et al.	2021-06-10
Thermocompression bond tips and related apparatus and methods Grant 11,024,595 - McClain , et al. June 1, 2	2021-06-01
Bond pad with micro-protrusions for direct metallic bonding Grant 10,923,448 - Yu , et al. February 16, 2	2021-02-16
Methods of making semiconductor devices Grant 10,734,370 - Ma , et al.	2020-08-04
Semiconductor die assemblies with heat sink and associated systems and methods Grant 10,636,678 - Zhou , et al.	2020-04-28
Methods Of Making Semiconductor Devices App 20190252362 - Ma; Zhaohui ; et al.	2019-08-15
Semiconductor devices comprising protected side surfaces and related methods Grant 10,312,226 - Ma , et al.	2019-06-04
Semiconductor Die Assemblies With Heat Sink And Associated Systems And Methods App 20190109019 - Zhou; Wei ; et al.	2019-04-11
Method for Solder Bridging Elimination for Bulk Solder C2S Interconnects App 20190067232 - WIRZ; BRANDON P. ; et al.	2019-02-28
Thermocompression Bond Tips And Related Apparatus And Methods App 20180366434 - McClain; Benjamin L. ; et al.	2018-12-20
Semiconductor die assemblies with heat sink and associated systems and methods Grant 10,153,178 - Zhou , et al. Dec	2018-12-11
Methods of manufacturing multi-die semiconductor device packages and related assemblies Grant 10,103,134 - Zhou , et al. October 16, 2	2018-10-16
Methods Of Manufacturing Multi-die Semiconductor Device Packages And Related Assemblies App 20180033781 - Zhou; Wei ; et al.	2018-02-01
Semiconductor Devices Comprising Protected Side Surfaces And Related Methods App 20180033780 - Ma; Zhaohui ; et al.	2018-02-01
Methods of manufacturing multi-die semiconductor device packages and related assemblies Grant 9,865,578 - Zhou , et al. January 9, 2	2018-01-09
Semiconductor Die Assemblies With Heat Sink And Associated Systems And Methods App 20170323802 - Zhou; Wei ; et al.	2017-11-09
Methods of processing wafer-level assemblies to reduce warpage, and related assemblies Grant 9,786,612 - Yu , et al. October 10, 2	2017-10-10
Semiconductor devices comprising protected side surfaces and related methods Grant 9,786,643 - Ma , et al. October 10, 2	2017-10-10
Bond Pad With Micro-protrusions For Direct Metallic Bonding App 20170287864 - Yu; Aibin ; et al.	2017-10-05
Semiconductor die assemblies with heat sink and associated systems and methods Grant 9,716,019 - Zhou , et al. July 25, 2	2017-07-25
Methods Of Processing Wafer-level Assemblies To Reduce Warpage, And Related Assemblies App 20170179045 - Yu; Aibin ; et al.	2017-06-22
Methods of processing wafer-level assemblies to reduce warpage, and related assemblies Grant 9,589,933 - Yu , et al. March 7, 2	2017-03-07
Methods Of Manufacturing Multi Die Semiconductor Device Packages And Related Assemblies App 20160358898 - Zhou; Wei ; et al.	2016-12-08
Semiconductor Die Assemblies With Heat Sink And Associated Systems And Methods App 20160233110 - Zhou; Wei ; et al.	2016-08-11
Semiconductor die assemblies with heat sink and associated systems and methods Grant 9,349,670 - Zhou , et al. May 24, 2	2016-05-24
Methods of protecting peripheries of in-process semiconductor wafers and related in-process wafers and systems Grant 9,337,064 - Zhou , et al. May 10, 2	2016-05-10
Bond Pad With Micro-protrusions For Direct Metallic Bonding App 20160093583 - Yu; Aibin ; et al.	2016-03-31
Methods Of Protecting Peripheries Of In-process Semiconductor Wafers And Related In-process Wafers And Systems App 20160079094 - Zhou; Wei ; et al.	2016-03-17
Semiconductor Die Assemblies With Heat Sink And Associated Systems And Methods App 20160035648 - Zhou; Wei ; et al.	2016-02-04
Semiconductor Devices Comprising Protected Side Surfaces And Related Methods App 20160013154 - Ma; Zhaohui ; et al.	2016-01-14
Methods Of Processing Wafer-level Assemblies To Reduce Warpage, And Related Assemblies App 20150371969 - Yu; Aibin ; et al.	2015-12-24
Methods for forming semiconductor device packages Grant 9,202,714 - Ma , et al. December 1, 2	2015-12-01
Methods For Forming Semiconductor Device Packages App 20130280861 - Ma; Zhaohui ; et al.	2013-10-24

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