Ma; Kin F.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ma; Kin F..The latest application filed is for "material removal method for forming a structure".
- Ma; Kin F. - Boise ID
| Patent | Date |
|---|---|
| Material removal method for forming a structure Grant 6,599,840 - Wu , et al. July 29, 2 | 2003-07-29 |
| Material removal method for forming a structure Grant 6,596,642 - Wu , et al. July 22, 2 | 2003-07-22 |
| Material removal method for forming a structure Grant 6,596,648 - Wu , et al. July 22, 2 | 2003-07-22 |
| Method for reducing capacitive coupling between conductive lines Grant 6,570,258 - Ma , et al. May 27, 2 | 2003-05-27 |
| Material removal method for forming a structure App 20020187648 - Wu, Zhiqiang ; et al. | 2002-12-12 |
| Material removal method for forming a structure App 20020182816 - Wu, Zhiqiang ; et al. | 2002-12-05 |
| Material removal method for forming a structure App 20020182872 - Wu, Zhiqiang ; et al. | 2002-12-05 |
| Material removal method for forming a structure Grant 6,461,967 - Wu , et al. October 8, 2 | 2002-10-08 |
| Material removal method for forming a structure App 20020001960 - Wu, Zhiqiang ; et al. | 2002-01-03 |
| Methods of making implanted structures Grant 6,309,975 - Wu , et al. October 30, 2 | 2001-10-30 |
| Method for reducing capacitive coupling between conductive lines App 20010028112 - Ma, Kin F. ; et al. | 2001-10-11 |
| Material removal method for forming a structure Grant 6,261,964 - Wu , et al. July 17, 2 | 2001-07-17 |
| Method for reducing capactive coupling between conductive lines Grant 6,259,162 - Ma , et al. July 10, 2 | 2001-07-10 |
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