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name:-0.013173818588257
name:-0.010437965393066
name:-0.0083508491516113
Ma; Feiyue Patent Filings

Ma; Feiyue

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ma; Feiyue.The latest application filed is for "method for forming a metal gapfill".

Company Profile
9.7.10
  • Ma; Feiyue - San Jose CA
  • Ma; Feiyue - Santa Clara CA
  • Ma; Feiyue - Sunnyvale CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for forming a metal gapfill
Grant 11,355,391 - Cen , et al. June 7, 2
2022-06-07
Metal recess for semiconductor structures
Grant 10,861,676 - Cui , et al. December 8, 2
2020-12-08
Metal recess for semiconductor structures
Grant 10,854,426 - Cui , et al. December 1, 2
2020-12-01
Method For Forming A Metal Gapfill
App 20200303250 - CEN; Xi ;   et al.
2020-09-24
Process integration approach of selective tungsten via fill
Grant 10,727,119 - Ren , et al.
2020-07-28
In-Situ Pre-Clean For Selectivity Improvement For Selective Deposition
App 20190385838 - Wu; Kai ;   et al.
2019-12-19
In-situ pre-clean for selectivity improvement for selective deposition
Grant 10,395,916 - Wu , et al. A
2019-08-27
Metal Recess For Semiconductor Structures
App 20190214230 - Cui; Zhenjiang ;   et al.
2019-07-11
Metal Recess For Semiconductor Structures
App 20190214229 - Cui; Zhenjiang ;   et al.
2019-07-11
Process Integration Approach Of Selective Tungsten Via Fill
App 20190157145 - REN; He ;   et al.
2019-05-23
Process integration approach of selective tungsten via fill
Grant 10,256,144 - Ren , et al.
2019-04-09
Process Integration Approach Of Selective Tungsten Via Fill
App 20180315650 - REN; He ;   et al.
2018-11-01
Electromigration Improvement Using Tungsten For Selective Cobalt Deposition On Copper Surfaces
App 20180144973 - Ye; Weifeng ;   et al.
2018-05-24
Methods To Selectively Deposit Corrosion-Free Metal Contacts
App 20180145034 - Xu; Yi ;   et al.
2018-05-24
Methods for forming low-resistance contacts through integrated process flow systems
Grant 9,947,578 - Lei , et al. April 17, 2
2018-04-17
In-Situ Pre-Clean For Selectivity Improvement For Selective Deposition
App 20180076020 - Wu; Kai ;   et al.
2018-03-15
Methods For Forming Low-resistance Contacts Through Integrated Process Flow Systems
App 20170148670 - LEI; YU ;   et al.
2017-05-25

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