Ma; Ching-Tien
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ma; Ching-Tien.The latest application filed is for "method for eliminating loading effect using a via plug".
- Ma; Ching-Tien - Shanghai CN
- Ma; Ching-Tien - US
- Ma; Ching-Tien - Tainan TW
- Ma; Ching-Tien - Kaohsiung TW
- Ma; Ching-Tien - Kaoshiung TW
| Patent | Date |
|---|---|
| Method for eliminating loading effect using a via plug Grant 8,089,153 - Hui , et al. January 3, 2 | 2012-01-03 |
| Contact etch stop film Grant 7,939,915 - Ho , et al. May 10, 2 | 2011-05-10 |
| Method For Eliminating Loading Effect Using A Via Plug App 20100133702 - XiangHui; Wu ; et al. | 2010-06-03 |
| Novel Contact Etch Stop Film App 20100029090 - Ho; Hok Min ; et al. | 2010-02-04 |
| Method for eliminating loading effect using a via plug Grant 7,655,554 - XiangHui , et al. February 2, 2 | 2010-02-02 |
| Contact etch stop film Grant 7,629,673 - Ho , et al. December 8, 2 | 2009-12-08 |
| Method for eliminating duo loading effect using a via plug App 20080308944 - XiangHui; Wu ; et al. | 2008-12-18 |
| Novel Contact Etch Stop Film App 20080128869 - Ho; Hok Min ; et al. | 2008-06-05 |
| Method for forming via and contact holes with deep UV photoresist Grant 6,830,877 - Ma , et al. December 14, 2 | 2004-12-14 |
| Method for dual-damascene formation using a via plug Grant 6,764,810 - Ma , et al. July 20, 2 | 2004-07-20 |
| Wet dip method for photoresist and polymer stripping without buffer treatment step Grant 6,652,666 - Ma , et al. November 25, 2 | 2003-11-25 |
| Method for dual-damascene formation using a via plug App 20030203321 - Ma, Ching-Tien ; et al. | 2003-10-30 |
| Method for forming via and contact holes with deep UV photoresist App 20030124464 - Ma, Ching-Tien ; et al. | 2003-07-03 |
| IMD film composition for dual damascene process Grant 6,570,257 - Chen , et al. May 27, 2 | 2003-05-27 |
| Wet dip method for photoresist and polymer stripping without buffer treatment step App 20020162578 - Ma, Ching-Tien ; et al. | 2002-11-07 |
| Novel IMD film composition for dual damascene process App 20020013024 - Chen, Dian-Hau ; et al. | 2002-01-31 |
| Inter-metal dielectric film composition for dual damascene process Grant 6,316,351 - Chen , et al. November 13, 2 | 2001-11-13 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 