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Reactor System Including A Gas Distribution Assembly For Use With Activated Species And Method Of Using Same App 20210102292 - Lin; Xing ;   et al. | 2021-04-08 |
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Tunable Ground Planes In Plasma Chambers App 20160145742 - Janakiraman; Karthik ;   et al. | 2016-05-26 |
Apparatus and method for substrate clamping in a plasma chamber Grant 9,337,072 - Balasubramanian , et al. May 10, 2 | 2016-05-10 |
Method And System For Supplying A Cleaning Gas Into A Process Chamber App 20160084400 - SANKARAKRISHNAN; Ramprakash ;   et al. | 2016-03-24 |
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Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure Grant 8,753,989 - Balseanu , et al. June 17, 2 | 2014-06-17 |
Method And System For Supplying A Cleaning Gas Into A Process Chamber App 20140076236 - SANKARAKRISHNAN; Ramprakash ;   et al. | 2014-03-20 |
Method and system for supplying a cleaning gas into a process chamber Grant 8,591,699 - Sankarakrishnan , et al. November 26, 2 | 2013-11-26 |
Method And System For Supplying A Cleaning Gas Into A Process Chamber App 20130213574 - Sankarakrishnan; Ramprakash ;   et al. | 2013-08-22 |
Method to minimize wet etch undercuts and provide pore sealing of extreme low k (k<2.5) dielectrics Grant 8,445,075 - Xu , et al. May 21, 2 | 2013-05-21 |
Air gap integration scheme Grant 8,389,376 - Demos , et al. March 5, 2 | 2013-03-05 |
Fluid filtration for substrate processing chamber Grant 8,382,885 - Ho , et al. February 26, 2 | 2013-02-26 |
Methods to improve the in-film defectivity of PECVD amorphous carbon films Grant 8,282,734 - Padhi , et al. October 9, 2 | 2012-10-09 |
Methods To Improve The In-film Defectivity Of Pecvd Amorphous Carbon Films App 20120204795 - Padhi; Deenesh ;   et al. | 2012-08-16 |
Method For Depositing An Amorphous Carbon Film With Improved Density And Step Coverage App 20120208373 - PADHI; DEENESH ;   et al. | 2012-08-16 |
Tunable Ground Planes In Plasma Chambers App 20120205046 - Janakiraman; Karthik ;   et al. | 2012-08-16 |
Method To Increase Silicon Nitride Tensile Stress Using Nitrogen Plasma In-situ Treatment And Ex-situ Uv Cure App 20120196450 - Balseanu; Mihaela ;   et al. | 2012-08-02 |
Method To Increase Tensile Stress Of Silicon Nitride Films Using A Post Pecvd Deposition Uv Cure App 20120196452 - Balseanu; Mihaela ;   et al. | 2012-08-02 |
Method to increase silicon nitride tensile stress using nitrogen plasma in-situ treatment and ex-situ UV cure Grant 8,138,104 - Balseanu , et al. March 20, 2 | 2012-03-20 |
Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure Grant 8,129,290 - Balseanu , et al. March 6, 2 | 2012-03-06 |
Method of depositing boron nitride and boron nitride-derived materials Grant 8,084,105 - Huh , et al. December 27, 2 | 2011-12-27 |
CMP pad thickness and profile monitoring system Grant 8,043,870 - Manens , et al. October 25, 2 | 2011-10-25 |
Fluid Filtration For Substrate Processing Chamber App 20110256041 - HO; Dustin W. ;   et al. | 2011-10-20 |
Methods to obtain low k dielectric barrier with superior etch resistivity Grant 7,964,442 - Xu , et al. June 21, 2 | 2011-06-21 |
Decreasing the etch rate of silicon nitride by carbon addition Grant 7,951,730 - Bhatia , et al. May 31, 2 | 2011-05-31 |
Method For Depositing An Amorphous Carbon Film With Improved Density And Step Coverage App 20110104400 - Padhi; Deenesh ;   et al. | 2011-05-05 |
Apparatus And Method For Substrate Clamping In A Plasma Chamber App 20110090613 - Balasubramanian; Ganesh ;   et al. | 2011-04-21 |
METHOD TO MINIMIZE WET ETCH UNDERCUTS AND PROVIDE PORE SEALING OF EXTREME LOW K (K<2.5) DIELECTRICS App 20110092077 - XU; HUIWEN ;   et al. | 2011-04-21 |
Method to improve the step coverage and pattern loading for dielectric films Grant 7,923,386 - Balseanu , et al. April 12, 2 | 2011-04-12 |
Methods and systems for forming at least one dielectric layer Grant 7,871,926 - Xia , et al. January 18, 2 | 2011-01-18 |
Method for depositing an amorphous carbon film with improved density and step coverage Grant 7,867,578 - Padhi , et al. January 11, 2 | 2011-01-11 |
Method to mitigate impact of UV and E-beam exposure on semiconductor device film properties by use of a bilayer film Grant 7,851,384 - Liu , et al. December 14, 2 | 2010-12-14 |
Method to deposit functionally graded dielectric films via chemical vapor deposition using viscous precursors Grant 7,802,538 - Padhi , et al. September 28, 2 | 2010-09-28 |
Clean process for an electron beam source Grant 7,790,583 - Demos , et al. September 7, 2 | 2010-09-07 |
Method to increase the compressive stress of PECVD dielectric films Grant 7,790,635 - Balseanu , et al. September 7, 2 | 2010-09-07 |
Method to improve the step coverage and pattern loading for dielectric films Grant 7,780,865 - Balseanu , et al. August 24, 2 | 2010-08-24 |
Vacuum reaction chamber with x-lamp heater Grant 7,777,197 - Al-Bayati , et al. August 17, 2 | 2010-08-17 |
Novel Air Gap Integration Scheme App 20100151671 - Demos; Alexandros T. ;   et al. | 2010-06-17 |
Method to increase the compressive stress of PECVD silicon nitride films Grant 7,732,342 - Balseanu , et al. June 8, 2 | 2010-06-08 |
Reduction of hillocks prior to dielectric barrier deposition in Cu damascene Grant 7,723,228 - Rajagopalan , et al. May 25, 2 | 2010-05-25 |
Techniques for the use of amorphous carbon (APF) for various etch and litho integration schemes Grant 7,718,081 - Liu , et al. May 18, 2 | 2010-05-18 |
Selective copper-silicon-nitride layer formation for an improved dielectric film/copper line interface Grant 7,718,548 - Lee , et al. May 18, 2 | 2010-05-18 |
Boron derived materials deposition method Grant 7,704,816 - Huh , et al. April 27, 2 | 2010-04-27 |
Oxide-like seasoning for dielectric low k films Grant 7,700,486 - Park , et al. April 20, 2 | 2010-04-20 |
Method and system for supplying a cleaning gas into a process chamber Grant 7,699,935 - Sankarakrishnan , et al. April 20, 2 | 2010-04-20 |
Apparatus and method for exposing a substrate to UV radiation using asymmetric reflectors Grant 7,692,171 - Kaszuba , et al. April 6, 2 | 2010-04-06 |
Memory cell having stressed layers Grant 7,678,662 - Arghavani , et al. March 16, 2 | 2010-03-16 |
Air gap integration scheme Grant 7,670,924 - Demos , et al. March 2, 2 | 2010-03-02 |
Method To Improve The Step Coverage And Pattern Loading For Dielectric Films App 20100048030 - BALSEANU; MIHAELA ;   et al. | 2010-02-25 |
High efficiency UV curing system Grant 7,663,121 - Nowak , et al. February 16, 2 | 2010-02-16 |
Method and System for Supplying a Cleaning Gas Into a Process Chamber App 20100012273 - Sankarakrishnan; Ramprakash ;   et al. | 2010-01-21 |
Method of depositing an amorphous carbon film for etch hardmask application Grant 7,638,440 - Wang , et al. December 29, 2 | 2009-12-29 |
Method And System For Supplying A Cleaning Gas Into A Process Chamber App 20090314309 - Sankarakrishnan; Ramprakash ;   et al. | 2009-12-24 |
Cmp Pad Thickness And Profile Monitoring System App 20090280580 - Manens; Antoine P. ;   et al. | 2009-11-12 |
Pad Properties Using Nanoparticle Additives App 20090278081 - M'Saad; Hichem ;   et al. | 2009-11-12 |
Multi-stage curing of low K nano-porous films Grant 7,611,996 - Schmitt , et al. November 3, 2 | 2009-11-03 |
Method to improve the step coverage and pattern loading for dielectric films Grant 7,601,651 - Balseanu , et al. October 13, 2 | 2009-10-13 |
Tunable Ground Planes In Plasma Chambers App 20090236214 - Janakiraman; Karthik ;   et al. | 2009-09-24 |
Blocker plate bypass to distribute gases in a chemical vapor deposition system Grant 7,572,337 - Rocha-Alvarez , et al. August 11, 2 | 2009-08-11 |
Integration process for fabricating stressed transistor structure Grant 7,566,655 - Balseanu , et al. July 28, 2 | 2009-07-28 |
High Efficiency Uv Curing System App 20090162259 - Nowak; Thomas ;   et al. | 2009-06-25 |
Decreasing The Etch Rate Of Silicon Nitride By Carbon Addition App 20090137132 - Bhatia; Ritwik ;   et al. | 2009-05-28 |
Methods and Systems for Forming at Least One Dielectric Layer App 20090104764 - Xia; Li-Qun ;   et al. | 2009-04-23 |
Methods For High Temperature Deposition Of An Amorphous Carbon Layer App 20090093128 - SEAMONS; MARTIN JAY ;   et al. | 2009-04-09 |
Method For Forming An Air Gap In Multilevel Interconnect Structure App 20090093100 - Xia; Li-Qun ;   et al. | 2009-04-09 |
Methods To Obtain Low K Dielectric Barrier With Superior Etch Resistivity App 20090093132 - XU; HUIWEN ;   et al. | 2009-04-09 |
Methods to improve the in-film defectivity of PECVD amorphous carbon films Grant 7,514,125 - Padhi , et al. April 7, 2 | 2009-04-07 |
Decreasing the etch rate of silicon nitride by carbon addition Grant 7,501,355 - Bhatia , et al. March 10, 2 | 2009-03-10 |
Formation of low K material utilizing process having readily cleaned by-products Grant 7,501,354 - Ho , et al. March 10, 2 | 2009-03-10 |
Methods To Improve The In-film Defectivity Of Pecvd Amorphous Carbon Films App 20090044753 - Padhi; Deenesh ;   et al. | 2009-02-19 |
Boron Derived Materials Deposition Method App 20090017640 - Huh; Jeong-Uk ;   et al. | 2009-01-15 |
Methods and apparatuses promoting adhesion of dielectric barrier film to copper App 20090011148 - Rajagopalan; Nagarajan ;   et al. | 2009-01-08 |
Adhesion improvement for low k dielectrics Grant 7,459,404 - Li , et al. December 2, 2 | 2008-12-02 |
Boron Nitride And Boron Nitride-derived Materials Deposition Method App 20080292798 - Huh; Jeong-Uk ;   et al. | 2008-11-27 |
Plasma-induced Charge Damage Control For Plasma Enhanced Chemical Vapor Deposition Processes App 20080254233 - LEE; KWANGDUK DOUGLAS ;   et al. | 2008-10-16 |
Method and apparatus for reducing charge density on a dielectric coated substrate after exposure to a large area electron beam Grant 7,425,716 - Demos , et al. September 16, 2 | 2008-09-16 |
Selective Copper-silicon-nitride Layer Formation For An Improved Dielectric Film/copper Line Interface App 20080213997 - Lee; Sang M. ;   et al. | 2008-09-04 |
Liquid precursors for the CVD deposition of amorphous carbon films Grant 7,407,893 - Seamons , et al. August 5, 2 | 2008-08-05 |
Novel Air Gap Integration Scheme App 20080182404 - DEMOS; ALEXANDROS T. ;   et al. | 2008-07-31 |
Method For Depositing An Amorphous Carbon Film With Improved Density And Step Coverage App 20080153311 - Padhi; Deenesh ;   et al. | 2008-06-26 |
Method To Increase The Compressive Stress Of Pecvd Dielectric Films App 20080146007 - Balseanu; Mihaela ;   et al. | 2008-06-19 |
Method of forming a phosphorus doped optical core using a PECVD process Grant 7,383,702 - M'Saad , et al. June 10, 2 | 2008-06-10 |
Reduction of hillocks prior to dielectric barrier deposition in Cu damascene Grant 7,371,427 - Rajagopalan , et al. May 13, 2 | 2008-05-13 |
Method For Forming An Ultra Low Dielectric Film By Forming An Organosilicon Matrix And Large Porogens As A Template For Increased Porosity App 20080107573 - Schmitt; Francimar ;   et al. | 2008-05-08 |
Method For Forming An Ultra Low Dielectric Film By Forming An Organosilicon Matrix And Large Porogens As A Template For Increased Porosity App 20080105978 - Schmitt; Francimar ;   et al. | 2008-05-08 |
Multi-stage Curing Of Low K Nano-porous Films App 20080099920 - Schmitt; Francimar ;   et al. | 2008-05-01 |
Apparatus And Method For Substrate Clamping In A Plasma Chamber App 20080084650 - Balasubramanian; Ganesh ;   et al. | 2008-04-10 |
Reduction Of Hillocks Prior To Dielectric Barrier Deposition In Cu Damascene App 20080075888 - Rajagopalan; Nagarajan ;   et al. | 2008-03-27 |
Apparatus And Method For Exposing A Substrate To Uv Radiation Using Asymmetric Reflectors App 20080067425 - Kaszuba; Andrzei ;   et al. | 2008-03-20 |
Clean Process for an Electron Beam Source App 20080041415 - Demos; Alexandros T. ;   et al. | 2008-02-21 |
Stress Reduction Of Sioc Low K Film By Addition Of Alkylenes To Omcts Based Processes App 20080044594 - Schmitt; Francimar C. ;   et al. | 2008-02-21 |
Method of forming a phosphorus doped optical core using a PECVD process Grant 7,325,419 - M'Saad , et al. February 5, 2 | 2008-02-05 |
Clean process for an electron beam source Grant 7,323,399 - Demos , et al. January 29, 2 | 2008-01-29 |
Method To Increase Silicon Nitride Tensile Stress Using Nitrogen Plasma In-situ Treatment And Ex-situ Uv Cure App 20080020591 - Balseanu; Mihaela ;   et al. | 2008-01-24 |
Decreasing the etch rate of silicon nitride by carbon addition App 20080014761 - Bhatia; Ritwik ;   et al. | 2008-01-17 |
Method for plasma processing App 20080008842 - Soo; Jyr Hong ;   et al. | 2008-01-10 |
Method For Depositing an Amorphous Carbon Film with Improved Density and Step Coverage App 20080003824 - Padhi; Deenesh ;   et al. | 2008-01-03 |
Methods To Improve The In-film Defectivity Of Pecvd Amorphous Carbon Films App 20070295272 - Padhi; Deenesh ;   et al. | 2007-12-27 |
METHOD TO MINIMIZE WET ETCH UNDERCUTS AND PROVIDE PORE SEALING OF EXTREME LOW K (K<2.5) DIELECTRICS App 20070287301 - Xu; Huiwen ;   et al. | 2007-12-13 |
Method To Mitigate Impact Of Uv And E-beam Exposure On Semiconductor Device Film Properties By Use Of A Bilayer Film App 20070281497 - Liu; Yijun ;   et al. | 2007-12-06 |
Method To Improve The Step Coverage And Pattern Loading For Dielectric Films App 20070232071 - Balseanu; Mihaela ;   et al. | 2007-10-04 |
Method To Improve The Step Coverage And Pattern Loading For Dielectric Films App 20070232082 - Balseanu; Mihaela ;   et al. | 2007-10-04 |
Enhancement of remote plasma source clean for dielectric films App 20070207275 - Nowak; Thomas ;   et al. | 2007-09-06 |
Low-k spacer integration into CMOS transistors App 20070202640 - Al-Bayati; Amir ;   et al. | 2007-08-30 |
Interface engineering to improve adhesion between low k stacks Grant 7,259,111 - Padhi , et al. August 21, 2 | 2007-08-21 |
Methodology for determining electron beam penetration depth Grant 7,259,381 - Liu , et al. August 21, 2 | 2007-08-21 |
Memory Cell Having Stressed Layers App 20070132054 - Arghavani; Reza ;   et al. | 2007-06-14 |
Method to improve the ashing/wet etch damage resistance and integration stability of low dielectric constant films App 20070134435 - Ahn; Sang H. ;   et al. | 2007-06-14 |
Method To Deposit Functionally Graded Dielectric Films Via Chemical Vapor Deposition Using Viscous Precursors App 20070079753 - Padhi; Deenesh ;   et al. | 2007-04-12 |
Non-intrusive plasma monitoring system for arc detection and prevention for blanket CVD films App 20070042131 - Soo; Jyr Hong ;   et al. | 2007-02-22 |
Method to deposit functionally graded dielectric films via chemical vapor deposition using viscous precursors Grant 7,166,544 - Padhi , et al. January 23, 2 | 2007-01-23 |
Vacuum Reaction Chamber With X-lamp Heater App 20060289795 - Dubois; Dale R. ;   et al. | 2006-12-28 |
Vacuum Reaction Chamber With X-lamp Heater App 20060272772 - Al-Bayati; Amir ;   et al. | 2006-12-07 |
Method Of Forming A Phosphorus Doped Optical Core Using A Pecvd Process App 20060266081 - M'Saad; Hichem ;   et al. | 2006-11-30 |
Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure App 20060269693 - Balseanu; Mihaela ;   et al. | 2006-11-30 |
Heated Gas Feedthrough For Cvd Chambers App 20060270221 - M'Saad; Hichem ;   et al. | 2006-11-30 |
Method to increase the compressive stress of PECVD silicon nitride films App 20060269692 - Balseanu; Mihaela ;   et al. | 2006-11-30 |
Integration process for fabricating stressed transistor structure App 20060270217 - Balseanu; Mihaela ;   et al. | 2006-11-30 |
High efficiency UV curing system App 20060249175 - Nowak; Thomas ;   et al. | 2006-11-09 |
High Efficiency Uv Curing System App 20060249078 - Nowak; Thomas ;   et al. | 2006-11-09 |
Tandem Uv Chamber For Curing Dielectric Materials App 20060251827 - Nowak; Thomas ;   et al. | 2006-11-09 |
Techniques For The Use Of Amorphous Carbon (apf) For Various Etch And Litho Integration Schemes App 20060231524 - Liu; Wei ;   et al. | 2006-10-19 |
Oxide-like Seasoning For Dielectric Low K Films App 20060219175 - Park; Sohyun ;   et al. | 2006-10-05 |
Oxide-like seasoning for dielectric low k films Grant 7,115,508 - Park , et al. October 3, 2 | 2006-10-03 |
In-situ oxide capping after CVD low k deposition Grant 7,112,541 - Xia , et al. September 26, 2 | 2006-09-26 |
Method Of Forming A Phosphorus Doped Optical Core Using A Pecvd Process App 20060207294 - M'Saad; Hichem ;   et al. | 2006-09-21 |
Nitrogen-free dielectric anti-reflective coating and hardmask Grant 7,105,460 - Kim , et al. September 12, 2 | 2006-09-12 |
Method and apparatus for reducing charge density on a dielectric coated substrate after exposure to a large area electron beam App 20060192150 - Demos; Alexandros T. ;   et al. | 2006-08-31 |
Adhesion improvement for low k dielectrics App 20060189162 - Huang; Lihua Li ;   et al. | 2006-08-24 |
Method of forming a phosphorus doped optical core using a PECVD process Grant 7,080,528 - M'Saad , et al. July 25, 2 | 2006-07-25 |
Formation of low K material utilizing process having readily cleaned by-products App 20060160374 - Ho; Dustin W. ;   et al. | 2006-07-20 |
Interface engineering to improve adhesion between low k stacks App 20060160376 - Padhi; Deenesh ;   et al. | 2006-07-20 |
Techniques for the use of amorphous carbon (APF) for various etch and litho integration scheme Grant 7,064,078 - Liu , et al. June 20, 2 | 2006-06-20 |
Method of forming low dielectric constant porous films Grant 7,060,638 - Nguyen , et al. June 13, 2 | 2006-06-13 |
Method for forming a low thermal budget spacer Grant 7,049,200 - Arghavani , et al. May 23, 2 | 2006-05-23 |
Tensile and compressive stressed materials for semiconductors App 20060105106 - Balseanu; Mihaela ;   et al. | 2006-05-18 |
Characterizing an electron beam treatment apparatus Grant 7,045,798 - Elsheref , et al. May 16, 2 | 2006-05-16 |
High-power dielectric seasoning for stable wafer-to-wafer thickness uniformity of dielectric CVD films App 20060093756 - Rajagopalan; Nagarajan ;   et al. | 2006-05-04 |
Adhesion improvement for low k dielectrics Grant 7,030,041 - Li , et al. April 18, 2 | 2006-04-18 |
Post treatment of low k dielectric films Grant 7,018,941 - Cui , et al. March 28, 2 | 2006-03-28 |
Method to deposit functionally graded dielectric films via chemical vapor deposition using viscous precursors App 20060046520 - Padhi; Deenesh ;   et al. | 2006-03-02 |
Methodology for determining electron beam penetration depth App 20060027764 - Liu; Josephine J. ;   et al. | 2006-02-09 |
Liquid precursors for the CVD deposition of amorphous carbon films App 20050287771 - Seamons, Martin Jay ;   et al. | 2005-12-29 |
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Blocker plate bypass to distribute gases in a chemical vapor deposition system App 20050263248 - Rocha-Alvarez, Juan Carlos ;   et al. | 2005-12-01 |
Method For Forming A Low Thermal Budget Spacer App 20050266622 - Arghavani, Reza ;   et al. | 2005-12-01 |
In-situ oxide capping after CVD low k deposition App 20050250348 - Xia, Li-Qun ;   et al. | 2005-11-10 |
Post Treatment Of Low K Dielectric Films App 20050239293 - Cui, Zhenjiang ;   et al. | 2005-10-27 |
Multi-stage curing of low K nano-porous films App 20050230834 - Schmitt, Francimar ;   et al. | 2005-10-20 |
Oxide-like seasoning for dielectric low k films App 20050227499 - Park, Sohyun ;   et al. | 2005-10-13 |
Method for forming an ultra low dielectric film by forming an organosilicon matrix and large porogens as a template for increased porosity App 20050227502 - Schmitt, Francimar ;   et al. | 2005-10-13 |
Method and apparatus for reducing charge density on a dielectric coated substrate after exposure to large area electron beam App 20050224722 - Demos, Alexandros T. ;   et al. | 2005-10-13 |
Low dielectric constant porous films App 20050215065 - Nguyen, Son Van ;   et al. | 2005-09-29 |
Deposition of low dielectric constant films by N2O addition App 20050214457 - Schmitt, Francimar ;   et al. | 2005-09-29 |
Method of depositing an amorphous carbon film for etch hardmask application App 20050202683 - Wang, Yuxiang May ;   et al. | 2005-09-15 |
Adhesion improvement for low k dielectrics App 20050202685 - Huang, Lihua Li ;   et al. | 2005-09-15 |
Characterizing An Electron Beam Treatment Apparatus App 20050184257 - Elsheref, Khaled A. ;   et al. | 2005-08-25 |
Methods and apparatuses promoting adhesion of dielectric barrier film to copper App 20050186339 - Rajagopalan, Nagarajan ;   et al. | 2005-08-25 |
Silicon carbide deposited by high density plasma chemical-vapor deposition with bias Grant 6,926,926 - Cho , et al. August 9, 2 | 2005-08-09 |
Nitrogen-free dielectric anti-reflective coating and hardmask Grant 6,927,178 - Kim , et al. August 9, 2 | 2005-08-09 |
Techniques for the use of amorphous carbon (APF) for various etch and litho integration scheme App 20050167394 - liu, Wei ;   et al. | 2005-08-04 |
HDP-CVD film for uppercladding application in optical waveguides App 20050089293 - M'Saad, Hichem | 2005-04-28 |
Stress reduction of sioc low k films App 20050037153 - Schmitt, Francimar C. ;   et al. | 2005-02-17 |
Nitrogen-free antireflective coating for use with photolithographic patterning Grant 6,853,043 - Yeh , et al. February 8, 2 | 2005-02-08 |
Stress reduction of SIOC low k film by addition of alkylenes to OMCTS based processes App 20040253378 - Schmitt, Francimar C. ;   et al. | 2004-12-16 |
Reduction of hillocks prior to dielectric barrier deposition in Cu damascene App 20040231795 - Rajagopalan, Nagarajan ;   et al. | 2004-11-25 |
Reduction of hillocks prior to dielectric barrier deposition in Cu damascene App 20040235292 - Rajagopalan, Nagarajan ;   et al. | 2004-11-25 |
Nitrogen-free dielectric anti-reflective coating and hardmask App 20040214446 - Kim, Bok Hoen ;   et al. | 2004-10-28 |
Apparatus for improving barrier layer adhesion to HDP-FSG thin films Grant 6,803,325 - M'Saad , et al. October 12, 2 | 2004-10-12 |
Nitrogen-free hard mask over low K dielectric App 20040185674 - M'Saad, Hichem ;   et al. | 2004-09-23 |
Clean process for an electron beam source App 20040159638 - Demos, Alexandros T. ;   et al. | 2004-08-19 |
Nitrogen-free antireflective coating for use with photolithographic patterning App 20040087139 - Yeh, Wendy H. ;   et al. | 2004-05-06 |
Method of forming a phosphorus doped optical core using a PECVD process App 20040079118 - M'Saad, Hichem ;   et al. | 2004-04-29 |
Barrier layer deposition using HDP-CVD Grant 6,713,390 - M'Saad , et al. March 30, 2 | 2004-03-30 |
Nitrogen-free dielectric anti-reflective coating and hardmask App 20040009676 - Kim, Bok Hoen ;   et al. | 2004-01-15 |
Low-bias-deposited high-density-plasma chemical-vapor-deposition silicate glass layers Grant 6,667,248 - M'Saad , et al. December 23, 2 | 2003-12-23 |
Reacting an organosilicon compound with an oxidizing gas to form an ultra low k dielectric App 20030211244 - Li, Lihua ;   et al. | 2003-11-13 |
HDP-CVD film for uppercladding application in optical waveguides App 20030113085 - M'Saad, Hichem | 2003-06-19 |
Method of manufacturing an optical core App 20030110808 - M'Saad, Hichem ;   et al. | 2003-06-19 |
Silicon carbide deposited by high density plasma chemical-vapor deposition with bias App 20030049388 - Cho, Seon-Mee ;   et al. | 2003-03-13 |
Low-bias-deposited high-density-plasma chemical-vapor-deposition silicate glass layers App 20030050724 - M'Saad, Hichem ;   et al. | 2003-03-13 |
Barrier layer deposition using HDP-CVD App 20030032282 - M'Saad, Hichem ;   et al. | 2003-02-13 |
Apparatus for improving barrier layer adhesion to HDP-FSG thin films App 20020150682 - M'Saad, Hichem ;   et al. | 2002-10-17 |
Barrier layer deposition using HDP-CVD Grant 6,399,489 - M'Saad , et al. June 4, 2 | 2002-06-04 |
Nitrogen Treatment Of Polished Halogen-doped Silicon Glass App 20010033900 - M'SAAD, HICHEM ;   et al. | 2001-10-25 |
Reduction of mobile ion and metal contamination in HDP-CVD chambers using chamber seasoning film depositions Grant 6,121,161 - Rossman , et al. September 19, 2 | 2000-09-19 |
Methods and apparatus for forming HDP-CVD PSG film used for advanced pre-metal dielectric layer applications Grant 6,013,584 - M'Saad January 11, 2 | 2000-01-11 |